Our Products

Robzorb™ GDS grade is robotically self levelling dispensable absorber silicone targeting 18-35 GHz band featuring high capacity process.

The Laird™ Eccostock™ 0005 material is a translucent polystyrene based thermosetting exhibiting low loss dielectric properties

The Laird™ Eccostock™ FFP free flowing powder is a low loss, one part, epoxy based that cures to a rigid non-burning syntactic foam.

The Laird™ Eccostock™ FlexK LoK elastomer is a low dielectric constant, low loss and low weight silicone rubber sheet for RF and microwave insulation.

The Laird™ Eccostock™ HiK platform is a series of low loss plastic stock with adjusted dielectric constants up to 15.

The Laird™ Eccostock™ HiK500F platform is a series of low loss plastic material with adjusted dielectric constants up to 30.

ECCOSTOCK LoK is a low dielectric loss, low dielectric constant, material made of lightweight thermosetting plastic for RF and microwave applications.

The Laird™ Eccostock™ PP foam is a closed cell, cross-linked polyethylene foam with low loss, low dielectric, and low density.

The Laird™ Eccostock™ SH material is a rigid closed cell polyurethane foam, which withstands high temperatures, for a short time even up to 163°C .

The Laird™ SoftZorb™ GDS gel type elastomer is a soft absorber for gap filling purpose with enhanced performance in coupling reduction in the 18 up to 35 Ghz.

The Laird™ SoftZorb™ MCS gel type elastomer is a soft absorber for gap filling purpose with enhanced performance in coupling reduction in the 800 Mhz to 18 Ghz.

Magnetic elastomeric microwave absorbers are excellent for outdoor use. A variety of configuration are available.

The Laird™ Eccosorb™ SLJ sheet is a dual-band nitrile rubber absorber sheet designed to have minimum reflection at 2 frequency bands i.e. X- and Ku bands.

Laird integrates microwave absorbing or reflecting properties into custom covers, screens and textile products to fit different application needs.

The RFFOAM product line is based upon open celled reticulated foam to address broadband free space application.

RFHC is a broadband microwave absorbing honeycomb core material.

RFSS screen absorbers are thin, lightweight absorbers that are optimized to provide a high degree of absorption for frequencies in the range of 1 to 18GHz.

Textured surface elastomer absorber , Rezorb™ S is a game changer in the reflectivity absorber application offering a robust and reliable alternative to foams.

The Laird™ Eccosorb™ SS-tapes are very high tack PSA tapes specifically designed for use with Laird’s absorbers.

The Laird™ Eccostock™ Adhesive 13111 is a one-part CFC-free general purpose glue.

RF/Microwave absorber Kit including multiples absorber types to cover the full frequency range from few Mhz to above 100Ghz.

Custom shields offer six sides of protection, with the sixth side being the board.

One-piece shields offer six sides of protection, with the sixth side being the board.

Shield with Spring Finger is a one-part shielding solution, No top-mount cover is applied, shield frame designed to surround heat-sensitive components.

Two-piece shields offer six sides of protection, with the sixth side being the board.

Clip-On and Edge Mount series is designed for applications that don't allow for the use of pressure sensitive adhesive for mounting.

Shield with Spring Finger is a one-part shielding solution, No top-mount cover is applied, shield frame designed to surround heat-sensitive components.

Slot mounted series is designed for use in a wide variety of slotted applications used as the mounting method.

Tape mounted series include pressure sensitive adhesive tape for mounting which provides a strong, instant bond to the mating surface.

SMD metal contacts are typically plated Beryllium Copper parts for use in a SMT solder reflow process, providing excellent grounding performance.

SMD metal contacts are typically plated Beryllium Copper parts for use in a SMT solder reflow process, providing excellent grounding performance.

SMD metal contacts are typically plated Beryllium Copper parts for use in a SMT solder reflow process, providing excellent grounding performance.

SMD metal contacts are typically plated Beryllium Copper parts for use in a SMT solder reflow process, providing excellent grounding performance.

SMD metal contacts are typically plated Beryllium Copper parts for use in a SMT solder reflow process, providing excellent grounding performance.

SMD metal contacts are typically plated Beryllium Copper parts for use in a SMT solder reflow process, providing excellent grounding performance.

SMD metal contacts are typically plated Beryllium Copper parts for use in a SMT solder reflow process, providing excellent grounding performance.

SMD metal contacts are typically plated Beryllium Copper parts for use in a SMT solder reflow process, providing excellent grounding performance.

SMD metal contacts are typically plated Beryllium Copper parts for use in a SMT solder reflow process, providing excellent grounding performance.

SMD metal contacts are typically plated Beryllium Copper parts for use in a SMT solder reflow process, providing excellent grounding performance.

Laird battery contacts are SMD Beryllium Copper parts with tape reel packaging for SMT processes, with excellent current transmission performance.

Laird battery contacts are SMD Beryllium Copper parts with tape reel packaging for SMT processes, with excellent current transmission performance.

Shield with Spring Finger is a one-part shielding solution, No top-mount cover is applied, shield frame designed to surround heat-sensitive components.

Clip-On and Edge Mount series is designed for applications that don't allow for the use of pressure sensitive adhesive for mounting.

Slot mounted series is designed for use in a wide variety of slotted applications used as the mounting method.

Tape mounted series include pressure sensitive adhesive tape for mounting which provides a strong, instant bond to the mating surface.

Metallized fabric combines highly conductive metals with lightweight fabric to meet a diverse range of EMI/ RFI shielding requirements.

Metallized fabric combines highly conductive metals with lightweight fabric to meet a diverse range of EMI/ RFI shielding requirements.

Metallized fabric combines highly conductive metals with lightweight fabric to meet a diverse range of EMI/ RFI shielding requirements.

Nickel / Copper Polyester Nonwoven lightweight electrically conductive metallized fabric. 0.40mm nominal thickness.

Nickel / Copper Polyester Taffeta lightweight electrically conductive metallized fabric. 0.10mm nominal thickness.

Nickel / Copper Nylon Ripstop lightweight electrically conductive metallized fabric. 0.11mm nominal thickness.

Nickel / Copper Polyester Mesh lightweight electrically conductive metallized fabric. 0.17mm nominal thickness.

Metallized fabric combines highly conductive metals with lightweight fabric to meet a diverse range of EMI/ RFI shielding requirements.

Metallized fabric combines highly conductive metals with lightweight fabric to meet a diverse range of EMI/ RFI shielding requirements.

Metallized fabric combines highly conductive metals with lightweight fabric to meet a diverse range of EMI/ RFI shielding requirements.

Metallized fabric combines highly conductive metals with lightweight fabric to meet a diverse range of EMI/ RFI shielding requirements.

Metallized fabric combines highly conductive metals with lightweight fabric to meet a diverse range of EMI/ RFI shielding requirements.

Sil25-RXP Form-In-Place, a single component, non-slump, high flexibility, room temperature silicone gasket material.

Sil35-HXP Form-In-Place, a non-slump, single component, high flexibility, thermally curable silicone rubber.

Laird’s Form-In-Place is an automated system for dispensing conductive elastomer EMI shielding and grounding gaskets onto metal or plastic substrates.

SNC45-RXP Ultrasoft™ Form-In-Place dispensable product is a Shore A 45, Nickel/Graphite filled silicone elastomer, room temperature curable.

SNC70 HXP Form In Place, a rapid cure, low cost nickel/graphite filled silicone elastomer Form In Place gasket material.

SNC70-RXP Form-In-Place, a rapid cure, nickel/graphite-filled silicone elastomer gasket material.

SNK55-RXP Form-In-Place, a rapid-cure, silver/copper-filled silicone elastomer gasket material.

SNK60-HXP Form In Place, a rapid cure, Silver/Copper filled silicone elastomer Form In Place gasket material.

SNL60-RXP Form-In-Place, a rapid cure, Silver/Aluminum-filled silicone elastomer Form-In-Place gasket material.

SNL70-RXP Form-In-Place, a rapid cure, Silver/Aluminum-filled silicone elastomer Form-In-Place gasket material.

A Silver/Nickel filled heat curable silicone Form-In-Place grade.

SNN1065HSLV Form-In-Place dispensable product is a 65 Shore A, Silver/Nickel filled silicone, thermally curable.

SNN55-HXP Form-In-Place dispensable product is a 55 Shore A, Silver/Nickel filled silicone elastomer, thermally curable.

SNN55-RXP Form-In-Place dispensable product is a 55 Shore A Silver/Nickel filled silicone elastomer, room temperature curable.

SNN60-RXP Form-In-Place, a rapid cure, silver/nickel-filled silicone elastomer Form-In-Place gasket material.

SNN65-HXP Form-In-Place, a rapid cure, silver/nickel-filled silicone elastomer Form-In-Place gasket material.

ElectroGround™ EMI washers are useful in applications where the need for EMI protection is required.

ElectroMesh™ tape product is a knitted wire shielding providing effective EMI shielding and grounding for electrical cable assemblies.

ElectroNit™ All Mesh knitted wire product is for low cycling applications and is designed to offer high levels of attenuation.

ElectroNit™ elastomer core EMI gasketing is an optimum solution for combining excellent shielding performance with a high degree of elasticity.

UltraFlex™ knitted wire mesh offers resiliency for consistent, point-to-point contact requiring the lowest compression forces among other shielding materials.

Soft SMD Contacts are good in electrically grounding. Usually, they can be soldered on PCB for grounding purpose or even shielding.

Soft SMD Contacts are good in electrically grounding. Usually, they can be soldered on PCB for grounding purpose or even shielding.

Soft SMD Contacts are good in electrically grounding. Usually, they can be soldered on PCB for grounding purpose or even shielding.

Soft SMD Contacts are good in electrically grounding. Usually, they can be soldered on PCB for grounding purpose or even shielding.

Soft SMD Contacts are good in electrically grounding. Usually, they can be soldered on PCB for grounding purpose or even shielding.

A lightweight, durable ventilation honeycomb panel that allows for airflow in/out of the application and provides EMI shielding.

Custom shields offer six sides of protection, with the sixth side being the board.

One-piece shields offer six sides of protection, with the sixth side being the board.

Shield with Spring Finger is a one-part shielding solution, No top-mount cover is applied, shield frame designed to surround heat-sensitive components.

Two-piece shields offer six sides of protection, with the sixth side being the board.

SMD metal contacts are typically plated Beryllium Copper parts for use in a SMT solder reflow process, providing excellent grounding performance.

SMD metal contacts are typically plated Beryllium Copper parts for use in a SMT solder reflow process, providing excellent grounding performance.

SMD metal contacts are typically plated Beryllium Copper parts for use in a SMT solder reflow process, providing excellent grounding performance.

SMD metal contacts are typically plated Beryllium Copper parts for use in a SMT solder reflow process, providing excellent grounding performance.

SMD metal contacts are typically plated Beryllium Copper parts for use in a SMT solder reflow process, providing excellent grounding performance.

SMD metal contacts are typically plated Beryllium Copper parts for use in a SMT solder reflow process, providing excellent grounding performance.

SMD metal contacts are typically plated Beryllium Copper parts for use in a SMT solder reflow process, providing excellent grounding performance.

SMD metal contacts are typically plated Beryllium Copper parts for use in a SMT solder reflow process, providing excellent grounding performance.

SMD metal contacts are typically plated Beryllium Copper parts for use in a SMT solder reflow process, providing excellent grounding performance.

Soft SMD Contacts are good in electrically grounding. Usually, they can be soldered on PCB for grounding purpose or even shielding.

Soft SMD Contacts are good in electrically grounding. Usually, they can be soldered on PCB for grounding purpose or even shielding.

Soft SMD Contacts are good in electrically grounding. Usually, they can be soldered on PCB for grounding purpose or even shielding.

Soft SMD Contacts are good in electrically grounding. Usually, they can be soldered on PCB for grounding purpose or even shielding.

Soft SMD Contacts are good in electrically grounding. Usually, they can be soldered on PCB for grounding purpose or even shielding.

Open bottom case construction with small size, accurate current matching capabilities over a broad range of inductance values.

Open bottom case construction with small size, accurate current matching capabilities over a broad range of inductance values. .High Current capabilty up to 1.2 A.

Multilayer type and small size with a wide frequency range, can be applied on high-speed differential signal interfaces such as HDMI, USB3.0 and DisplayPort.

Small Size, Multilayer type chokes with a wide frequency range and can be applied on high-speed differential signal interfaces such as HDMI, USB3.0 and DisplayPort.

Wire Wound Type Broadband common mode filter for Gbps-level high-speed differential signal interfaces (cut off frequency up to 6GHz) such as HDMI, USB3.0.

Wire Wound type with excellent common mode filter characteristics. Impedance for common mode noise can clear 600 Ohm [100MHz]. Our chokes exhibit good EMC suppression.

Wire Wound type with excellent common mode filter characteristics. Impedance for common mode noise can clear 600 Ohm (100MHz). Our chokes exhibit good EMC suppression.

Wire Wound SMT construction allows performance at a high temperature range. The chokes feature high reliability and performance and meet automotive application requirements.

Wire Wound SMT construction allows performing at high temperature range. High reliability , performance and meet Automotive application requirements.

Wire Wound SMT construction allows performance at a high temperature range. The chokes feature high reliability and performance and meet automotive application requirements.

Open bottom case construction, with small size, broadband noise filtering from 100 KHz to 100 MHz along with excellent EMI suppression results..

Wire Wound SMT construction allows performance at a high temperature range. They feature reliability and performance and meet automotive application requirements.

Wire Wound SMT construction allows performance at a high temperature range. They feature high reliability and performance and meet automotive application requirements.

Wire Wound SMT structure allows high rated current. Low DCR within a small package. Stable performance under load bias. Excellent impedance vs frequency features.

Wire Wound SMT and through hole structure with excellent impedance characteristics at high frequency making the chokes great for suppressing common mode noise.

Wire Wound through hole structure with excellent impedance characteristics at high frequency, making the chokes great for suppressing common mode noise.

Open bottom case construction, with small size, broadband noise filtering from 100 KHz to 100 MHz along with excellent EMI suppression results.

Wire Wound through hole structure with excellent impedance characteristics at high frequency, making the chokes great for suppressing common mode noise.

Wire Wound SMT structure allows high rated current. Low DCR with small package. Stable performance under load bias. Excellent impedance vs frequency features.

Wire Wound SMT and through hole structure allow high rated current and stable performance. Low DCR within a small package. Excellent impedance vs frequency features.

Wire Wound through hole structure with excellent impedance characteristics at high frequency, making the chokes great for suppressing common mode noise.

Wire Wound through hole structure allows high rated current and stable performance. Low DCR and excellent impedance vs frequency features.

Wire Wound SMT and through hole structure with excellent impedance characteristics at high frequency, making the chokes great for suppressing common mode noise.

Wire Wound through hole structure with excellent impedance characteristics at high frequency, making the chokes great for suppressing common mode noise.

Wire Wound through hole structure with excellent impedance characteristics at high frequency, making the chokes great for suppressing common mode noise.

Wire Wound SMT and through hole structure allow rated current up to 60A. Low DCR and high performance. Excellent impedance vs frequency features.

Wire Wound SMT and Through Hole structure allow high rated current and stable performance. Low DCR and Excellent impedance vs frequency features

Wire Wound through hole structure with excellent impedance characteristics at high frequency, making the chokes great for suppressing common mode noise.

Broadband frequency power line common mode chokes withstand severe operating environments, with substantial normal mode noise suppression capability.

Wire Wound through hole structure allows extra high rated current and stable performance. Low DCR and excellent impedance vs frequency features.

Laird™ CMA0805 series automotive common mode chokes have low profiles and a compact design which improves performance and reliability while reducing total EMC cost.

Superior chokes offering a high current rating up to 50A, stable performance and high suppression of asymmetric interference at both low and high frequencies.

Superior chokes offer a high current rating up to 62A, stable performance and high suppression of asymmetric interference at both low and high frequencies.

Wire wound Thru hole structure with differential molde EMI filter function. Low DCR and high currennt with excellent EMI noise suppression.

Wire Wound Surface mount structure with very low DCR and high current. Excellent EMI Noise Suppression at Broadband Frequency Range .

Wire wound Thru hole structure with differential molde EMI filter function. Low DCR and high currennt with excellent EMI noise suppression.

Wire Wound Surface mount structure with very low DCR and high current. Excellent EMI Noise Suppression at Broadband Frequency Range .

Monolithic construction, small footprint and high reliability, excellent retention under bias. For power line, low frequency and high frequency signal lines

Monolithic construction, small footprint and high reliability, excellent retention under bias. For power line, low frequency and high frequency signal lines

Monolithic construction, small footprint and high reliability, excellent retention under bias. For power line, low frequency and high frequency signal lines

Monolithic construction, small footprint and high reliability, excellent retention under bias. For power line, low frequency and high frequency signal lines

Monolithic construction with high currrent, low DCR and high reliability, excellent retention under bias. Mainly for power line noise filtering.

Monolithic construction with high current, low DCR and high reliability, excellent retention under bias. Mainly for power lines noise filtering.

Monolithic construction with high current, low DCR and high reliability, excellent retention under bias. For both power line and signal lines

Monolithic construction with high currrent, low DCR and high reliability, excellent retention under bias. For both power line and signal lines

Monolithic construction with small footprint and high reliability, excellent retention under bias. Mainly for power lines noise filtering.

Monolithic construction with high currrent, low DCR and high reliability, excellent retention under bias. Mainly for power lines noise filtering.

Wire Wound SMT and through hole structure with Excellent impedance characteristics at high frequency, making it great for suppressing differential mode noise.

Low profile ferrite components used for connector assemblies and board connector leads to suppress EMI Noise.

Act as an effective shielding material to concentrate and direct magnetic flux between the transmitter and receiver devices.

Suppresion of radiated and inductively-coupled electronmagnetic interference. Also a material to concentrate and direct magnetic flux between the TX and RX.

Suppresion of radiated and inductively-coupled electronmagnetic interference. Also a material to concentrate and direct magnetic flux between the TX and RX.

A Simple solution which can be installed directly on the source of EMI for suppresion of radiated and inductively-coupled electronmagnetic interference.

Suppresion of radiated and inductively-coupled electronmagnetic interference. Also a material to concentrate and direct magnetic flux between the TX and RX.

Standard 28 material optimized for superior EMI suppression. Open magnetic structure of the core can bear large DC bias before saturate.

Flexible magnetic sheets managing magnetic flux improves the overall energy and data transfer in NFC, RFID, and Wireless Power systems,

Flexible magnetic sheets managing magnetic flux improves the overall energy and data transfer in NFC, RFID, and Wireless Power systems,

Flexible magnetic sheets managing magnetic flux improves the overall energy and data transfer in NFC, RFID, and Wireless Power systems,

Two-hole balun cores used for single and dual broadband transformer cores. Also for common-mode and differential-mode EMI suppression.

For wound and used as cores for transformers inductors or chokes. Various materials and sizes allow good performance at different frequency ranges.

High permeability, thin and flexible Nanocrystalline sheets suppressing EMI in electronic system and improving energy transfer in wireless power system,

Designed ideally for high efficiency applications, Laird MAF series power inductors improve performance, reliability and power efficiency.

Designed ideally for high efficiency applications, Laird MAF series power inductors improve performance, reliability and power efficiency.

Laird™ MGAH series high operation temperature and high current power molded inductors improve performance, reliability and power efficiency currents.

Laird™ MGAH series high operation temperature and high current power molded inductors improve performance, reliability and power efficiency currents.

Laird™ MGAH series high operation temperature and high current power molded inductors improve performance, reliability and power efficiency currents.

Designed ideally for automotive safety applications, Laird MGHS series high temperature power inductors improve performance, reliability and power efficiency.

Designed ideally for automotive safety applications, Laird MGHS series high temperature power inductors improve performance, reliability and power efficiency.

Designed ideally for automotive safety applications, Laird MGHS series high temperature power inductors improve performance, reliability and power efficiency.

Magnetically Shielded construction with excellent handling of high transient current spikes. Ultra low buzz noise, Low L/R ratio in this package size.

Magnetically Shielded construction with excellent handling of high transient current spikes. Ultra low buzz noise, Low L/R ratio in this package size.

Magnetically Shielded construction with excellent handles high transient current spikes. Ultra low buzz noise, Low L/R ratio in this package size.

Magnetically Shielded construction with excellent handling of high transient current spikes. Ultra low buzz noise, Low L/R ratio in this package size.

Magnetically Shielded construction with excellent handling of high transient current spikes. Ultra low buzz noise, Low L/R ratio in this package size.

Magnetically Shielded construction with excellent handling of high transient current spikes. Ultra low buzz noise, Low L/R ratio in this package size.

Magnetically Shielded construction with excellent handling of high transient current spikes. Ultra low buzz noise, Low L/R ratio in this package size.

Magnetically Shielded construction with excellent handling of high transient current spikes. Ultra low buzz noise, Low L/R ratio in this package size.

Magnetically Shielded construction with excellent handling of high transient current spikes. Ultra low buzz noise, Low L/R ratio in this package size.

Magnetically Shielded construction with excellent handling of high transient current spikes. Ultra low buzz noise, Low L/R ratio in this package size.

Magnetically Shielded construction with excellent handling of high transient current spikes. Ultra low buzz noise, Low L/R ratio in this package size.

Magnetically Shielded construction with excellent handling of high transient current spikes. Ultra low buzz noise, Low L/R ratio in this package size.

Magnetically Shielded construction with excellent handling of high transient current spikes. Ultra low buzz noise, Low L/R ratio in this package size.

Magnetically shielded construction with excellent handling of high transient current spikes. Ultra-low buzz noise, low L/R ratio in this package size.

Magnetically Shielded construction with excellent handling of high transient current spikes. Ultra low buzz noise, Low L/R ratio in this package size.

Magnetically Shielded construction with excellent handling of high transient current spikes. Ultra low buzz noise, Low L/R ratio in this package size.

Small size with magnetically shielded construction, excellent handling of high transient current spikes. Ultra low buzz noise, Low L/R ratio in this size.

Small size with magnetically shielded construction, excellent handling of high transient current spikes. Ultra low buzz noise, Low L/R ratio in this size.

Small size with magnetically shielded construction, excellent handling of high transient current spikes. Ultra low buzz noise, Low L/R ratio in this size.

Small size with magnetically shielded construction, excellent handling of high transient current spikes. Ultra low buzz noise, Low L/R ratio in this size.

Designed ideally for automotive safety applications, Laird MGVS series high current power inductors improve performance, reliability and power efficiency.

Designed ideally for automotive safety applications, Laird MGVS series high current power inductors improve performance, reliability and power efficiency.

Designed ideally for automotive safety applications, Laird MGVS series high current power inductors improve performance, reliability and power efficiency.

Molded Construction with extremely low DCR with greater efficiency and enable a larger current in a small size. Operating temperatures ranging from -40C to 125C

Molded Construction with extremely low DCR with greater efficiency and enable a larger current in a small size. Operating temperatures ranging from -40C to 150C

Small-size, economical with wide inductance range. Monolithic structure with high performance on signal circuit.

Small-size, economical with wide inductance range. Monolithic structure with high performance on signal circuit.

Small-size, economical with wide inductance range. Monolithic structure with high performance on signal circuit.

Small Size using low-loss magnetic material. Low DCR and high performance under DC loading.

Small Size using low-loss magnetic material. Low DCR and high performance under DC loading.

Small Size using low-loss magnetic material. Low DCR and high performance under DC loading.

Small Size using low-loss magnetic material. Low DCR and high performance under DC loading.

Small-Size using low-loss magnetic material. Low DCR and high performance under DC loading.

Laird™ IWC0402 Series Wire-Wound Ceramic chip inductors are compact and robust design which improve performance and reliability at high frequency range.

Laird™ IWC0603 Series Wire-Wound Ceramic chip inductors are compact and robust design which improve performance and reliability at high frequency range.

Laird™ IWC0805 Series Wire-Wound Ceramic chip inductors are compact and robust design which improve performance and reliability at high frequency range.

Laird™ IWC1008 Series Wire-Wound Ceramic chip inductors are compact and robust design which improve performance and reliability at high frequency range.

Wound type rod inductor with high current for power circuits. Extremely low DC and AC resistance exhibit large current and high power efficiency.

Wound type rod inductor with high current for power circuits. Extremely low DC and AC resistance exhibit large current and high power efficiency.

Wound type rod Inductor with high current for power circuits. Extremely low DC and AC resistance exhibit large current and high power efficiency.

Molded Construction with extremely low DCR with greater efficiency and enable a larger current in a small size. Operating temperatures ranging from -40C to 125C

Low profile high current inductor for power circuits. Metal Alloy core with magnetic resin shield construction, achieving large current and high performance.

Low profile high current inductor for power circuits. Metal Alloy core with magnetic resin shield construction, achieving large current and high performance.

Low profile high current inductor for power circuits. Metal Alloy core with magnetic resin shield construction, achieving large current and high performance.

Low profile high current inductor for power circuits. Metal Alloy core with magnetic resin shield construction, achieving large current and high performance.

Low profile high current inductor for power circuits. Metal Alloy core with magnetic resin shield construction, achieving large current and high performance.

Low profile high current inductor for power circuits. Metal Alloy core with magnetic resin shield construction, achieving large current and high performance.

Low profile high current inductor for power circuits. Metal Alloy core with magnetic resin shield construction, achieving large current and high performance.

Small-Size wound type and low profile inductor for power circuits. Magnetic resin shield construction, achieving high current and low DCR.

Small-Size wound type and low profile inductor for power circuits. Magnetic resin shield construction, acheiving high current and low DCR.

Small-Size wound type and low profile inductor for power circuits. Magnetic resin shield construction, acheiving high current and low DCR.

Small-Size wound type and low profile inductor for power circuits. Magnetic resin shield construction, achieving high current and low DCR.

Small-Size wound type and low profile inductor for power circuits. Magnetic resin shield construction, achieving high current and low DCR.

Small-Size wound type and low profile inductor for power circuits. Magnetic resin shield construction, achieving high current and low DCR.

Small Size wound type and low profile inductor for power circuits. Magnetic resin shield construction, achieving high current and low DCR.

Small-Size wound type and low profile inductor for power circuits. Magnetic resin shield construction, achieving high current and low DCR.

Wound type and low profile inductor for power circuits. Magnetic resin shield construction, achieving high current and low DCR.

Wound type and low profile inductor for power circuits. Magnetic resin shield construction, achieving high current and low DCR.

Wound type and low profile inductor for power circuits. Magnetic resin shield construction, achievinghHigh current and low DCR.

Wound type and low profile inductor for power circuits. Magnetic resin shield construction, achieving high current and low DCR.

Wound type and low profile inductor for power circuits. Magnetic resin shield construction, achieving high current and low DCR.

Wound type and low profile inductor for power circuits. Magnetic resin shield construction, achieving high current and low DCR.

Wound type and low profile inductor for power circuits. Magnetic resin shield construction, acheving high current and low DCR.

Wound type and low profile inductor for power circuits. Magnetic resin shield construction, achieving high current and low DCR.

Wound type and low profile inductor for power circuits. Magnetic resin shield construction, achieving high current and low DCR.

Maximize charging efficiency, reduce device size and thickness. Multi-function materials integration available to achieve high reliability test requirements.

Maximize charging efficiency, reduce device size and thickness. Multi-function materials integration available to achieve high reliability test requirements.

Act as an effective shielding material to concentrate and direct magnetic flux between the transmitter and receiver devices.

Suppresion of radiated and inductively-coupled electronmagnetic interference. Also a material to concentrate and direct magnetic flux between the TX and RX.

Suppresion of radiated and inductively-coupled electronmagnetic interference. Also a material to concentrate and direct magnetic flux between the TX and RX.

A Simple solution which can be installed directly on the source of EMI for suppresion of radiated and inductively-coupled electronmagnetic interference.

Suppresion of radiated and inductively-coupled electronmagnetic interference. Also a material to concentrate and direct magnetic flux between the TX and RX.

Flexible magnetic sheets managing magnetic flux improves the overall energy and data transfer in NFC, RFID, and Wireless Power systems,

Flexible magnetic sheets managing magnetic flux improves the overall energy and data transfer in NFC, RFID, and Wireless Power systems,

Flexible magnetic sheets managing magnetic flux improves the overall energy and data transfer in NFC, RFID, and Wireless Power systems,

Board level shield cover with RF Absorber preventing EMI Challenges in mmWave range

Flexible very low height board level shield cover with superior thermal transfer abilities

Board level shield cover with pre-applied thermal transfer material

Advanced die-cast, deep drawn, or stamped heatsink enhanced with TIM / CoolZorb™ /FIP /EMI Shielding/RF Absorber solutions

The Laird™ Eccosorb™ JCP PA compound is an injection molded absorber grade based on a polyamide thermoplastic matrix covering frequencies above 35Ghz.

The Laird™ Eccosorb™ JCP-PBT-252 compound is an injection molded absorber grade based on a PBT thermoplastic matrix covering frequencies above 35Ghz.

The Laird™ Eccosorb™ JCP-PP9 compound is an injection molded absorber grade based on a proprietary blended polypropylene based material.

The Laird™ Eccosorb™ MF platform is a series of rigid magnetically loaded epoxy stock.

Eccosorb™ MF-LCP-115 is a Liquid Crystal Polymer-based and magnetic loaded absorber for injection molding. Working frequency covering 5GHz to 40GHz.

The Laird™ Eccosorb™ MF-PA compound is a high temperature,magnetically loaded, polyamide thermoplastic absorber covering 1 to 35 Ghz frequency range.

The Laird™ Eccosorb™ MF-PP compound is a magnetically loaded polypropylene thermoplastic absorber covering 1 to 35 Ghz frequency range.

The Laird™ Eccosorb™ MF-PPS compound is a reflow compliant, polyphenylene sulfide thermoplastic absorber covering 1 to 35 Ghz frequency range..

The Laird™ Eccosorb™ MF-TPE compound is a flexible, magnetically loaded, thermoplastic elastomer absorber covering 1 to 35 Ghz frequency range.

The Laird™ Eccosorb™ MF500F platform is a series of high temperature rigid, magnetically loaded epoxy.

Injection molded radome with signal enhancing RF absorber skirt for automotive applications

The Laird™ ReZorb™ product is a tuned injection molded material with specific geometry surface system to achieve significant radar signal reflection reduction.

1.2W/mK silicone based pad with high compliancy

1.2W/mK silicone based thermal pad with guarenteed dieletric barrier

2.8W/mK silicone based pad with high compliancy

3W/mK silicone based pad with low dielectric constant

3W/mK silicone based pad with low dielectric constant

The Laird™ Tflex™ B200 gap filler offers good thermal performance and handling with enforcement options for a variety of application.

2.8W/mK silicone based pad with high deflection

2.8W/mK silicone based pad with guaranteed dielectric barrier

Tflex™ HD7.5 gap filler is a new developed very soft silicone material in our high deflection series

5W/mK silicone based pad with high deflection

6W/mK silicone based pad with high deflection

7.5W/mK silicone based pad with high deflection and low oil bleed

34W/mK non-silicone based pad filled by alligned graphite fiber

6.5W/mK silicone based pad with high reconvery

3W/mK silicone based pad with high reconvery

1.2W/mK silicone based pad with guaranteed dielectric barrier

3W/mK silicone based pad with guaranteed dielectric barrier

10W/mK non-silicone based pad with high compliance

16W/mK non-silicone based pad with high compliance

4W/mK non-silicone based pad with high compliance

3W/mK non-silicone based pad

7.8W/mK non-silicone based pad with high compliance

7.8W/mK non-silicone based pad

Tflex UT20000 is an ultra-thin gap filler that offers excellent thermal performance and high compliancy.

The Laird™ Tgon™ 800 product is an electrically conductive natural graphite thermal gap filler.

The Laird™ Tpli™ 200 material is an exceptionally soft, highly compressible gap filler

3W/mK silicone based putty-like pad with high compliancy

Tgel 600 is an all-in-one dispensable that can be used in constant pressure applications (grease) and used as a thick gap filler in a constant gap

Tgrease™ 1500 thermal grease is a cost effective solution for standard thermal grease needs

Tgrease 2500 is a non-silicone based formulation thermal grease for use in high performance applications.

High Temperature Stable Thermal Grease

Tgrease 300X is a silicone-based thermal grease for use in high performance CPUs and GPU.

3.6W/mK silicone based Liquid Gap Filler

3.6W/mK silicone based Liquid Gap Filler with lower hardness

5.4W/mK silicone based Liquid Gap Filler

6.4W/mK silicone based Liquid Gap Filler

9.2W/mK silicone based Liquid Gap Filler

The Laird™ Tputty™ 403 product is one part silicone based liquid dispensable thermal gap filler that has low abrasive properties.

The Laird™ Tputty™ 508 product is one part silicone based liquid dispensable thermal gap filler with excellent thermal performance and reliability.

6.4W/mK silicone based Liquid Gap Filler

6.2W/mK silicone Liquid Gap Filler with higher fluidity

9.1W/mK silicone based Liquid Gap Filler

5.6W/mK non-silicone Liquid Gap Filler

Tpcm 200SP is a non-silicone based formulation screen printable phase change material.

Tpcm™ 5000 is designed to provide the best performance to price available.

Tpcm™ 580 phase change material is 3.8 W/mK and designed to meet the thermal reliability and price requirements of high-end thermal application.

With a thermal conductivity of 7.5 W/mK, Tpcm™ 7000 is designed to enhance the cooling of the most rigorous thermal challenges in electronics

Tpcm™ 7000Plus is enhanced version or Tpcm 7000 requiring lower temperature burn-in (melt/flow),

Tpcm™ 780 phase change material at 5.5 W/mK, is a high performance phase change TIM, offering low thermal resistance and excellent reliability

Tpcm™ 780SP phase change material at 5.5 W/mk, is a high performance screen printable phase change material.

Tpcm™ 900 phase change material is a naturally tacky phase change offering reliable thermal performance.

Tpcm AL52 is a thermally conductive phase change material coated on both sides of aluminum foil.

Homogeneous compressible pad material providing thermal transfer and microwave absorber capabilities in one; 2 W/mK

Homogeneous compressible pad material providing thermal transfer and microwave absorber capabilities in one; 2 W/mK

Homogeneous compressible pad material providing thermal transfer and microwave absorber capabilities in one; 4 W/mK

Homogeneous high deflection pad material providing thermal transfer and microwave absorber capabilities in one; 3 W/mK

Homogeneous compressible non-silicone based pad material providing thermal transfer and microwave absorber capabilities in one; 11.5 W/mK

Compressible thermal transfer gasket enabling device insertion or heat transfer over large gaps with high thermal conductivity

Compressible thermal transfer gasket enabling device insertion or heat transfer over large gaps with high thermal conductivity

Electrically and thermally conductive foam gasket for space sensitive designs or efficient large gap size heat transfer with grounding

Thermal interface solution for sliding applications and datacenter pluggable modules.

The Laird™ Tgon™ 800 product is an electrically conductive natural graphite thermal gap filler.

High Performance Thermally Conductive Adhesive Tape

High performance insulator consisting of fiberglass reinforced silicone pad

Tgard™ 300 is a medium thermal performance insulator pad

Medium thermal performance insulator pad

Good dielectric material consisting of a polyimide film coated with thermal silicone rubber.

High-performance electrically insulating PI film

High thermal and dielectric performance insulating PI film

High thermal and dielectric performance insulator consisting of coated phase change compound

Heat curable epoxy film with thermally conductive and electrically insulating performance

Thermally Conductive Pre-Preg

Thermally Conductive Pre-preg