One-Piece Board Level Shields with Spring Fingers
One-Piece Board Level Shields
Product Description
BMI-S-608 is a one-part shielding solution with current applications in the automotive sector. No top-mount cover is applied to its four-sided shield frame designed to surround heat-sensitive components. Instead, the diecast/heat sink main housing is placed directly inside the shield frame and is clasped tightly by the integrated contact spring fingers. BMI-S-608 provides cost-effective EMI shielding of components while its spring fingers create electrical contact and grounding of the diecast/heat sink. The snug fit and secure sealing of the diecast housing ensures it will retain direct, surface-to-surface contact with high thermal load integrated circuits. View Case Study
Product Video
Image Gallery
Industries
- 5G Telecom
- 6G Telecom
- Aerospace/Defense
- Automotive and Industrial Electronics
- Consumer Electronics
- Electric Vehicle
- Healthcare / Medical
- Industrial Electronics
- Medical
- Military
- Telecom, 5G, Consumer, Automotive, Military
- Test and Measure
Applications
- Automotive ADAS
- Automotive Electronics
- Automotive Infotainment
- EMI Shielding
- PCB Component Level Shielding
Features and Benefits
- Enhanced design freedom involving PCB layout
- Permits reduction in spacing between adjacent shields
- Enables easier repairs of components
- Rigid Corner
- No tooling costs with standard off-the-shelf designs
- Alternative to multi-component manufacturer solutions
- Base materials: Stainless steel X10 CrNi18-8, (EN 1.4310)
- Surface plating/finish: Pre-plated matte tin plating: 2-5 μm
- Underlayer nickel: Minimum 1 μm
- Superior solderability and corrosion performance
- Version-Dimensions: Surface mount device frame 39,6mm 39,6mm 7mm
- Operating temperature: -40°C up to +125°C, Short-term +150°C
- Material thickness: 0.2mm
- Flatness/Coplanarity: Typically, <0.10mm
Capabilities
Technical Specification
Typical Properties
Flatness / Coplanarity< 0.10 mm typicalMaterial TypesStainless steel X10 CrNi18-8, (EN 1.4310)Mounting TypeSMDPlatingPre-plated matte tin plating: 2-5 μm / Underlayer nickel: Minimum 1 μmShelf LifeTypical 12 MonthsStorage Temperature (C)<40° C; <75% RHElectromagnetic Properties
Shielding Effectiveness (dB)typcially 40 dB @1 GHzCompliance
Moisture Sensitivity Level1ROHS CompliantYesOptions
Packaging
PackagingTray; Tape and Reel; Foam/Layer Pack