Die Attach Adhesives
Delivering Performance in Extraordinary Conditions
DuPont Electronics & Industrial’s leading-edge portfolio of silicone die attach adhesives delivers proven, dependable bonds for the most demanding chip applications in automotive, communications, consumer electronics, and industrial markets. Well-suited to work with various substrate materials and flexible curing conditions, all our advanced die attach adhesive products enhance the reliability of your electronics by offering:
- High purity
- Strong moisture resistance
- Low modulus with outstanding stress relief
- Excellent primer-less adhesion to a wide range of substrate material
Additionally, our solvent-less line of die attach silicones are environmentally responsible and cure at a range of temperatures - further reducing thermal stress and energy consumption. All materials in this product family are one-part silicones and can be processed using standard microelectronics equipment.
What Are Die Attach Adhesives?
Die attach adhesives are used to attach semiconductor chips to packaging substrates. In addition to forming the attachment, they can help mitigate stress and control warpage during system operation. Some die attach adhesives are formulated to be both thermally conductive and electrically insulating.
Reliable Performance at High Temperature Operation
DuPont’s selection of die attach solutions offers versatile options for superior chip design. Materials are designed to provide flexible curing conditions and optimized rheological properties for ease of application, and ensure strong adhesion with various substrate surfaces with different coefficients of thermal expansion.
Our Semiconductor Assembly Portfolio
DuPont delivers a full portfolio of packaging and assembly materials for the semiconductor industry. Click here to view a short video of our comprehensive offerings.
