Thermal Interface Materials

DuPont Electronics & Industrial's thermally-conductive silicones are designed to withstand the heat of today’s high-functioning electronics, delivering powerful adhesive, sealing and stress mitigation capabilities for applications in semiconductor packaging, communications, consumer devices, power electronics and automotive markets. Our broad portfolio includes adhesives and gels formulated for both room-temperature and heat-cure processing. With so much function and performance crammed into today’s mobile and high-end computing devices, managing heat is more critical than ever. DuPont’s thermally conductive silicones achieve high thermal conductivity even at extreme operating conditions where other organic materials often degrade.

Adhesives
To expand design and manufacturing flexibility, our adhesives conform to a variety of surfaces, reducing interfacial resistance and achieving uniform bond line thickness. Excellent stress relief with strong adhesive characteristics of silicone-based materials minimize warpage and ensure reliable bonding of sensitive devices.

Gels
Our thermally-conductive silicone gels keep sensitive electronic components clean and cool. The low modulus provides stress relief from extreme thermal and mechanical stresses.

What are Thermal Interface Materials?
Thermal interface materials (TIMs) are materials used to dissipate and improve the transfer of heat out of electronics devices. Generally, they are placed between the heat-generating chip and/or component and the heat spreading substrate or dissipating device.

Our Semiconductor Assembly Portfolio
DuPont delivers a full portfolio of packaging and assembly materials for the semiconductor industry. Click here to view a short video of our comprehensive offerings.