Specialty TIMS
Thermal Interface Materials
As the challenges of thermal management materials morph into needed multi-functional capabilities Laird answers the call. Laird offers beyond the standard class of TIMs, Thermal Interface materials with unique dual functionality. Tgon™ 800, graphite sheets and pads offer good Z axis thermal conductivity and superb x-y heat spreading. OptiTIM™ has been ruggedized to endure sliding stresses of module insertions. Coolzorb™ pads offer EMI absorption while still providing soft, high thermal conductive gap filling. For large gap, high resilience interfaces, Laird offers GOF (graphite over foam) and COF (copper over foam) pads. See below more details
Specialty TIMS Series
CoolZorb™ 200
Homogeneous compressible pad material providing thermal transfer and microwave absorber capabilities in one; 2 W/mK
CoolZorb™ 400
Homogeneous compressible pad material providing thermal transfer and microwave absorber capabilities in one; 2 W/mK
CoolZorb™ 500
Homogeneous compressible pad material providing thermal transfer and microwave absorber capabilities in one; 4 W/mK
CoolZorb™ HD500
Homogeneous high deflection pad material providing thermal transfer and microwave absorber capabilities in one; 3 W/mK
CoolZorb™-Ultra
Homogeneous compressible silicone free pad material providing thermal transfer and microwave absorber capabilities in one; 11.5 W/mK
GOF1000
Compressible thermal transfer gasket enabling device insertion or heat transfer over large gaps with high thermal conductivity
GOF2000
Compressible thermal transfer gasket enabling device insertion or heat transfer over large gaps with high thermal conductivity
GOF3000
Electrically and thermally conductive foam gasket for space sensitive designs or efficient large gap size heat transfer with grounding
OptiTIM™
The Laird™ OptiTIM™ product is designed to be used in Optical Module Transceiver Systems
Tgon 800
The Laird™ Tgon™ 800 product is an electrically conductive natural graphite thermal gap filler.