Thermal & Power
A prominent growth sector, Thermal & Power capitalizes on design advancements now enabling and protecting billions of individual electronic devices as well as entire systems. We are a world leader in high-performance thermal interface materials (TIM) and TIM automated application solutions. Coupled with our design know-how, our thermal products fill in air gaps and microscopic irregularities, resulting in significantly lower thermal resistance and thus better cooling of increasingly hotter 5G and other components. More effective heat transfer helps a new product achieve faster regulatory compliance. Likewise, Laird™ Steward™ product designers also work with global customers, delivering consistently high-performing inductive components that measurably improve power delivery by preserving signal integrity. This area is comprised of wireless charging products, inductors for power and signal lines, and electromagnetic compatibility (EMC) solutions. Thermal & Power is comprised of:
- Gap Fillers / Thermal Interface Materials
- Liquid Gap Fillers
- Inductive Components - EMC Components and Ferrite Cores
- Inductive Components - Inductors for Power and Signal Lines
- Inductive Components - Wireless Charging Coils
Electromagnetic
The ability of Laird products to mitigate disruptive waste energy is reflected in our Electromagnetic business. A range of technologies in this sector, borne of the material sciences, significantly lowers stray electromagnetic interference. Microwave absorbers and mm wave absorbers in various configurations reduce the negative effects of radiated energy. As an enclosure solution, fabric-over-foam gaskets are a popular choice for applications requiring low compression force but also needing high conductivity and shielding attenuation. Our form-in-place elastomers are compatible with plastic, metal, and plated substrates. Customized electrically conductive elastomers provide environmental sealing for added protection. More than 400 standard Laird fingerstock metal gaskets are available for grounding and shielding. Standard surface mount board level shields are available in both one- and two-piece designs. The Electromagnetic business incorporates:
Integrated Solutions
Exciting progress within our Integrated Solutions business bodes well for manufacturers who rely on Laird for answers to daunting device design obstacles. We enjoy a growing reputation for successfully partnering with companies worldwide to integrate co-engineering practices. The blending of people from each organization, Laird products and technologies are the difference. Together we produce, to exacting requirements, both modified board-level shielding and modified precision metal parts. Laird resolves any device structural issue put before us. Similarly, our fast-growing multi-functional solutions team and related product line (called Laird ISE) are helping component manufacturers conquer design issues involving high-speed, high-volume data transfer in increasingly dense packages. More power, more heat, tight (and shrinking) space and their interrelated performance issues are addressed holistically - and resolved – through Laird’s multi-functional solutions. Integrated Solutions consists of: