High current low DCR molded SMT power inductor

High thermal performance with exceptionally low hardness

A 6.5 w/mK thermal pad with superior spring back vibration resistance

Low-volatile heat curable form-in-place silicone paste

Single-Part Dispensable Gap Filler

Extreme low profile power inductors

Two-part, dispensable gap filler

Non-silicone based gap fillers

An ultra-soft, two-part dispensable gap filler

An all-in-one solution for thin bondline and large gap applications

Integrated and cost-saving shielding solution

Thermally conductive, electrically insulative adhesive film