Introducing BMI-S-608
Extend shielding functionality and save costs
Laird’s BMI-S-608 shield frame, with its coverless, stainless-steel design, features rows of integrated contact spring fingers positioned on each inner sidewall of the four-sided shield. Traditional shield covers are unnecessary when using this new addition to Laird’s standard board level shield product line. The shield’s structure not only helps mitigate EMI but functions as an integral structural part of a manufacturer’s separate diecast/heat sink main housing. BMI-S-608’s spring fingers grasp the heat sink housing directly. This tightly integrates the heat sink directly with the PCB’s heat-sensitive components. The diecast/heat sink (lid) and spring fingers (frame) combination provides a shielding solution surrounding the PCB. Reducing required spacing between adjacent shields, making repairs easier and lowering labor costs, BMI-S-608 enables added design flexibility. Automotive/ADAS/AVS, domain and central vehicle controllers, infotainment smart boxes, instrument cluster displays, radio navigation systems, and higher power computing are among the initial applications.
Introducing BMI-S-608
Integrated and cost-saving shielding solution
Remove complexity from the thermal transfer chain
BMI-S-608 is a one-part shielding solution with current applications in the automotive sector. No top-mount cover is applied to its four-sided shield frame designed to surround heat-sensitive components. Instead, the diecast/heat sink main housing is placed directly inside the shield frame and is clasped tightly by the integrated contact spring fingers. BMI-S-608 provides cost-effective EMI shielding of components while its spring fingers create electrical contact and grounding of the diecast/heat sink. The snug fit and secure sealing of the diecast housing ensures it will retain direct, surface-to-surface contact with high thermal load integrated circuits. Features, benefits, and specifications include:
- Enhanced design freedom involving PCB layout
- Permits reduction in spacing between adjacent shields
- Enables easier repairs of components
- Alternative to multi-component manufacturer solutions
- Base materials: Stainless steel X10 CrNi18-8, (EN 1.4310)
- Surface plating/finish: Pre-plated matte tin plating: 2-5 μm
- Underlayer nickel: Minimum 1 μm
- Superior solderability and corrosion performance
- Version-Dimensions: Surface mount device frame 39,6mm 39,6mm 7mm
- Operating temperature: -40°C up to +125°C, Short-term +150°C
- Material thickness: 0.2mm
- Flatness/Coplanarity: Typically, <0.10mm
Markets and Selected Applications:
- Automotive/ADAS/AVS
- Infotainment smart boxes, Radio Navigation System, instrument cluster displays
- Higher power computing
- Central vehicle controllers
- Domain controllers
