Introducing Tgel™ 600
Transfer heat in the most demanding applications
Design engineers can now use one material solution to meet all of their thermal needs. Laird™ Tgel™ 600 is a new dispensable thermal interface material designed to work in a variety of situations – from minimum bondline constant pressure applications to large, fixed-gap applications. With 6.4 W/mK bulk thermal conductivity and minimal pump out, Tgel™ 600 is targeted to cool the most demanding high wattage components. It can also be used within the same system package to serve as a gap filler and cool secondary components.
A new thermal material for effective heat transfer
Introducing Tgel™ 600
An all-in-one solution for thin bondline and large gap applications
Best-in-class thermal resistance
Tgel™ 600 has a minimum bondline thickness of ~20µm and can fill gaps up to 2mm. It is an ideal solution in any application that requires effective, reliable heat transfer, including data centers, IGBTs, consumer electronics, telecom systems and more.
- Low thermal resistance <0.06°C-cm2/W in constant pressure applications
- 6.4 W/mK bulk thermal conductivity
- Extremely low pump out
- High thixotropy, which enables good vertical reliability
- Good dispensing characteristics
- Optimized dispensing flowability
- Easy rework
- Uniquely developed to fill 30µm to 200µm fixed gap applications
A unique, dispensable thermal solution
- Operating temperature range: -40°C to 125°C
- Minimum bondline thickness: 20µm
- Volume resistivity: 1x 1011 Ω-cm
- Density: 2.63 g/cc
- Available in cans, pails, cartridges and syringes
- Shelf life of six months when stored at 15°C to 30°C, at 50% RH
