Tflex™ HR6.5
Tflex™ HR6.5
Product Description
Laird’s Tflex™ HR6.5 gap filler is a thermal interface material with a thermal conductivity of 6 W/m-K and high recovery properties. This product is designed to withstand cyclic gap changes due to vibration, shock, or warpage, maintaining consistent thermal performance over the life of the part. It also exhibits rebound properties after pressure is removed.
Tflex™ HR6.5 material will provide minimal stress on components and is easily assembled. In many cases it can be reused after rework due to its good rebound capability.
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Industries
- Cloud
- Computing
- Datacom
- Telecom, 5G, Consumer, Automotive, Military
Applications
- Base station/Power amplifier/Acitve antenna unit /small cell
- Automotive Infotainment
- Automotive Electronics
- Instrumentation/Test and measure
- Computer servers
- Notebooks/Tablets/Portable Devices
Features and Benefits
· >6.0 W/mK thermal conductivity
· High resiliency and good recovery
· Low peak and residual force
· Low outgassing and oil bleeding
· Good elongation
Capabilities
Datasheets
Tflex HR6.5 data sheet Last updated03/09/26Technical Specification
Typical Properties
ColorgreyDensity (g/cc)3.20Minimum Bondline Thickness (mm)1.00Operating Temperature Max (Celsius)150Operating Temperature Min (Celsius)-50Outgassing CVCM (%)0.060Outgassing TML (%)0.310Shelf Lifeone yearThermal Properties
Thermal Conductivity (W/mK)6.20Thermal Resistance @10 psi Max (C-in2/W)0.323Thermal Resistance @10 psi Min (C-in2/W)0.240Thermal Resistance @30 psi Max (C-in2/W)0.194Thermal Resistance @30 psi Min (C-in2/W)0.161Thermal Resistance @50 psi Max (C-in2/W)0.149Thermal Resistance @50 psi Min (C-in2/W)0.126Electrical Properties
Dielectric Breakdown Voltage (Volts AC)7000.0Volume Resistivity1.00 x10^14 Ohm-cmMechanical Properties
Hardness (Shore 00)50Dimensions
Thickness Max (inches)0.060Thickness Max (mm)2.00Thickness Min (inches)0.040Thickness Min (mm)1.00Compliance
Lead FreeYesREACHYesROHS CompliantYes