SMD Metal Contacts
Custom Precision Metal Stamping – EMI & Non-EMI
Grounding contacts are SMD Beryllium Copper parts with reel packaging for general SMT processes, with excellent grounding performance.
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Capabilities
SMD Metal Contacts Series
| Product image | Product name | Width(mm) | Plating | Technical datasheet |
|---|---|---|---|---|
| BDG Grounding Contacts | 2.00 | Au, other options available upon request Au (Typ) | ||
| BXG Grounding Contacts | 2.50 | Au, other options available upon request Au (Typ) | ||
| B3G Grounding Contacts | 3.00 | Au, other options available upon request Au (Typ) | ||
| B4G Grounding Contacts | 2.50 | Au, other options available upon request Au (Typ) | ||
| BCG Grounding Contacts | 2.50 | Au, other options available upon request Au (Typ) | ||
| General Battery Contacts | 7.95 | "Bright Nickel, other options available upon request" "Bright Tin, other options available upon request" | ||
| B5G Grounding Contacts | 4.00 | Au, other options available upon request Au (Typ) | ||
| Coin Cell Battery Contacts | 3.81 | "Gold, other options available upon request" "Bright Finish, other options available upon request" | ||
| B8G Grounding Contacts | 2.50 | Au, other options available upon request Au (Typ) | ||
| B7G Grounding Contacts | 2.50 | Au, other options available upon request Au (Typ) | ||
| B6G Grounding Contacts | 2.00 | Au, other options available upon request Au (Typ) | ||
| BMI Grounding Contacts | 1.50 | Tin Au Au/Tin | ||
| One-Piece Board Level Shields with Spring Fingers | 39.60 | Pre-plated matte tin plating: 2-5 μm / Underlayer nickel: Minimum 1 μm |