Specialty TIM
Multi-function Solutions (MFS)
Merged Functionality
Laird Specialty TIM solutions merge thermal conductivity with EMI shielding or RF absorbing capabilities into a component to meet your demands for cutting-edge products. Today’s electronics are creating more heat, operating at higher frequencies, requiring tighter packaging, and relying on cleaner signals from their antennas to compete in an ever-evolving market landscape. Laird solutions are targeted directly to meet these challenges and needs with specialty designed hybrid thermal interface materials.
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Specialty TIM Sub-Groups
CoolZorb
Homogeneous compressible pad material providing thermal transfer and microwave absorber capabilities in one.
Coolshield Flex
Flexible very low height board level shield cover with superior thermal transfer abilities.
Graphite over Foam (GOF)
Compressible thermal transfer gasket enabling device insertion or heat transfer over large gaps with high thermal conductivity; with or without electrical conductivity.