Semiconductor Assembly Materials

Production-proven Solutions for Assembly

By working in collaboration with leading-edge packaging and assembly houses, DuPont Electronics & Industrial sets the bar for excellence. Our materials are developed based on the latest requirements and are proven in high-volume manufacturing. New formulations are developed rapidly and tested against the most stringent requirements with our customers. Decades of experience has made us market leaders in silicones, dielectrics, and permanent bonding materials.

Choose DuPont as your materials solutions partner to:

• Get a complete solution, not just materials
• Tap into years of expertise and technology from across Electronics & Industrial
• Benefit from development that stays ahead of the  industry trends.

What are Semiconductor Assembly Materials?
Semiconductor assembly materials are the class of materials used during the electronics package assembly processes to manage heat, insulate, bond, and encapsulate. They make our mobile devices smarter and more reliable, network connections faster, and the IoT possible.

At the Heart of Heterogeneous Integration
Semiconductor assembly materials provide the foundation for today's heterogeneous integration technologies by serving a variety of functions. They enable permanent bonding processes for 2.5D and 3D integrated package architectures and provide the interconnect capabilities and protection for integrating MEMS, sensors, ICs into system-in-package (SiP) configurations. These materials must be designed to:

• protect against mechanical and thermal stress
  improve thermal management
  increase device reliability
  prevent high frequency signal transmission loss

Visit our page on the Dupont Website for more information:  Semiconductor Assembly Materials