Tflex™ CR350S Thermal Gap Filler
An ultra-soft thermal solution for high-vibration applications
Tflex™ CR350S is a new, two-part dispensable thermal gap filler ideal for high-vibration applications, primarily due to its ultra-soft composition that meets vertical shock and vibration requirements and decreases stress on the chip. The gap filler provides a low thermal resistance and high reliability. Further, with low bonding force, it protects components during disassembly and eases rework. And, Tflex CR350S is a cure-in-place solution with a high-flow rate, two attributes making it easy to dispense and perfectly fill large gaps using a variety of equipment.
Introducing Tflex™ CR350S
An ultra-soft, two-part dispensable gap filler
A dispensable gap filler with high reliability
Given its softness and high reliability, Tflex™ CR350S is an ideal liquid gap filler solution for applications including automotive, graphic chips, microprocessors, and telecom base stations.
- 3.6W/mK thermal conductivity
- 50 Shore 00 hardness
- Easily reworkable
- Dispensable and compliant
- Meets ROHS and REACH requirements
Product Performance
- Flow rate: 19 g/min
- Operating temperature range: -55°C to 200°C
- Minimum bondline thickness: 85µm
- Density: 3.16 g/cc
