Introducing Tflex™ SF4 and Tflex™ SF7
An expansion to Laird’s non-silicone based thermal solutions
Joining Tflex™ SF10, Laird has developed two non-silicone based TIMs – Tflex™ SF4 and Tflex™ SF7. These soft, non-silicone based gap fillers offer superior thermal performance without overstressing boards and components. Featuring 4 W/mk and 7 W/mK thermal conductivity, respectively, these gap fillers offer excellent deflection properties and extremely low thermal resistance.
Meet the Tflex™ SF family of non-silicone based gap fillers.
Soft, non-silicone based solutions for a variety of industries
With multiple thermal performance options and low thermal resistance, Tflex™ non-silicone based gap fillers are ideal for a variety of industries, including applications in data centers, automotive, telecom, military and aerospace.
- Non-silicone based formulation
- Multiple thermal performance options
- Low peak and residual pressure
- Excellent surface wetting for low contact resistance
- Exceptionally low thermal resistance
- UL V-0 flammability rating
An environmentally friendly thermal solution
- RoHS and REACH compliant
- Operating temperature range: -65°C to 150°
- Thickness: 0.5mm-4mm
- Custom thicknesses available upon request
- Density: 3.1 g/cc for Tflex™ SF4 and 3.4 g/cc for Tflex™ SF7
- Available in DF (eliminate tack from one side) and A1 (adhesive added to one side)
