Tflex™ SF10
Non-silicone Based Formulation Thermal Gap Filler
Product Description
Tflex SF10 is an innovative high performing thermal material in Laird’s gap filler portfolio. The non-silicone based formulation material measures 10 W/mk and has excellent deflection properties which provides minimal pressure on components. Very little pressure is required to reach the lowest possible thermal resistance.
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Industries
- Automotive
- Consumer
- Industrial
- Telecom/Datacom
- Aerospace/Defense
Applications
- Automotive Electronics
- Automotive ADAS
- Automotive Powertrain/ECUs
- Automotive Infotainment
- Routers
- Hard Disk Drives
- Solid State Drives
- Wireless infrastructure
- Drones/Satellites
- Gaming Systems
- Smart Home Devices
- Notebooks/Tablets/Portable Devices
Features and Benefits
- Non-silicone based formulation
- Low Shore Hardness
- Low pressure versus deflection
- Minimizes board and component stress
- No fiberglass reinforcement
- Environmentally friendly solution that meets regulatory requirements including RoHS and REACH
Capabilities
Datasheets
Tflex SF10 Datasheet Last updated03/24/26Technical Specification
Typical Properties
ColorGreyDensity (g/cc)3.70Operating Temperature Max (Celsius)125Operating Temperature Min (Celsius)-40Outgassing CVCM (%)0.150Outgassing TML (%)0.330Reinforcement CarriernoneShelf Life2 years from Date of ShipmentThermal Properties
Thermal Conductivity (W/mK)10.20Thermal Resistance @10 psi Max (C-in2/W)0.492Thermal Resistance @10 psi Min (C-in2/W)0.054Thermal Resistance @30 psi Max (C-in2/W)0.043Thermal Resistance @30 psi Min (C-in2/W)0.041Thermal Resistance @50 psi Max (C-in2/W)0.042Thermal Resistance @50 psi Min (C-in2/W)0.039Electrical Properties
Dielectric Constant9.00Volume Resistivity1 x 10^14Mechanical Properties
Hardness (Shore 00)41Dimensions
Thickness Max (Microns)5000.0Thickness Max (inches)0.200Thickness Max (mm)5.00Thickness Min (Microns)500.0Thickness Min (inches)0.020Thickness Min (mm)0.50Compliance
Lead FreeYesREACHYesROHS CompliantYes