Introducing Laird™ Tflex™ SF16 non-silicone based gap filler
Industry-leading thermal conductivity for high-performance, next-generation electronic applications
The latest addition to Laird’s family of non-silicone based gap fillers, Tflex™ SF16 delivers industry-leading 16 W/mK thermal conductivity with exceptionally low hardness. Designed to meet the demands of next-generation data center, automotive and consumer electronics applications, Tflex™ SF16 thermal gap filler provides high thermal performance without compromising component protection or reliability. Combining high conductivity with soft material properties, low oil bleed and high reliability, Laird™ Tflex™ SF16 thermal pads are well-suited for sensitive assemblies and high-density designs.
Laird™ Tflex™ SF16 thermal gap filler: High thermal performance with exceptionally low hardness
Engineered for high-performance data center, automotive and advanced electronics applications
Tflex™ SF16 is purpose-built for applications where power density is increasing and effective thermal management is critical, including data center applications such as servers, switches, and pluggable modules, as well as automotive electronic control units and computing modules. Features include:
- Non-silicone based formulation
- Exceptionally low thermal resistance
- Low hardness
- Low oil bleed
- Excellent surface wetting for low contact resistance
- Naturally tacky surfaces
- Complies with regulatory requirements including RoHS and REACH
Reliable, non-silicone-based thermal performance
- Thermal conductivity: 16 W/mK
- Density: 3.09 g/cc
- Temperature range: -40°C to 125°C
- Hardness (shore 00) (3 second): 40 (1mm – 5mm), 62 (0.5mm – 0.75mm)
