Tflex™ SF16

Non-Silicone Based Gap Filler

Product Description

Tflex SF16 is an innovative, high performing thermal material in Laird's non-silicone based gap filler portfolio.  The non-silicone based technology provides products with excellent deflection properties, providing minimal pressure on components during deflection.   Very little pressure is required to reach the lowest possible thermal resistance.  Thickness ranges from 0.5mm (0.020") to 5mm (0.200") in 0.5mm (0.020") increments available as standard.
Primary Image of Tflex SF16

Features and Benefits

·   Non-silicone based formulation

·   Exceptionally low thermal resistance

·   Low peak and residual pressure

·   Excellent surface wetting for low contact resistance

·   Environmentally friendly solution that meets regulatory requirements including ROHS and REACH

Capabilities

  1. Automated Packaging
  2. Automated Pad Placement
  3. Custom Automation
  4. Custom Product Development
  5. Modeling
  6. Prototyping
  7. Service
  8. Testing

Datasheets

Tflex SF16 Data Sheet Last updated10/08/25

Technical Specification

  • Typical Properties
    Color
    Light Grey
    Density (g/cc)
    3.09
    Operating Temperature Max (Celsius)
    125
    Operating Temperature Min (Celsius)
    -40
    Outgassing CVCM (%)
    0.220
    Outgassing TML (%)
    0.600
    Shelf Life
    2 years from Date of Shipment
  • Thermal Properties
    Thermal Conductivity (W/mK)
    16.00
  • Mechanical Properties
    Hardness (Shore 00)
    40
  • Compliance
    Lead Free
    Yes
    REACH
    Yes
    ROHS Compliant
    Yes