Introducing SNN1055HSLV
A Low-Volatile Heat Curable Form-in-Place Silicone Paste for High-Speed Dispensing
Form-in-place grade SNN1055HSLV is an extremely low-volatile EMI shielding material for high-speed dispensing of ultra-small bead dimensions in applications such as optical transceivers. A silver/nickel filled, two-hour heat curable silicone paste, SNN1055HSLV offers 300 MHz to 40 GHz tight-fitting cavity-to-cavity shielding effectiveness. Besides its low volatility (CVCM<0.1%), the enclosure material’s balanced mechanical properties include low Shore hardness, low outgassing (TML<1%), low compression set, and excellent adhesion strength.
Visualize high-speed, low bead-size, form-in-place dispensing cards.
A silicone paste shielding small, delicate devices from EMI
SNN1055HSLV mitigates optical transceiver EMI and provides benefits in other data center, aerospace, automotive, and electronics applications such as mobile phones and PCs.
- Shielding effectiveness: 300 MHz to 40 GHz, cavity-to-cavity
- Curing: 2-hour full cure at 100°C minimum
- Compression set: 20% at 125°C, 22 hours
- Density: 3.0 g/cm3 (uncured); 3,6 g/cm3 (cured)
- 55 Shore A hardness
- Adhesion strength: >180 N/cm2
- Low volatility (CVCM<0.1%) and low outgassing (TML<1%)
Design, production and storage-friendly choice for form-in-place needs
- Operating temperature: -55 to 125°C
- Storage temperature: -20±10°C
- Shelf life: 6 months
