Tputty™ 607MF

One Part Liquid Dispensable Gap Filler

Product Description

Tputty™ 607MF is a high thermally conductive single part dispensable gap filler specially designed to response to today’s need for high-speed assembly. It’s 105g/min flow rate benefit engineers seeking productivity improvement within assembly operations. With 6.2W/mK thermal conductivity and high reliability, Tputty 607MF is ideal for various applications.
Tputty™ 607MF is a soft, compliant, high thermal conductivity dispensable gap filler providing the lowest thermal resistance and highest reliability available.
Tputty 607MF Primary Image

Features and Benefits

·       6.2W/mK thermal conductivity 

·       High flow rate and good tackiness

·       Easily reworkable

·       Demonstrated thermal cycling stability

·       Meets ROHS and REACH requirements

Capabilities

  1. Automated Packaging
  2. Automated Pad Placement
  3. Custom Automation
  4. Custom Product Development
  5. Modeling
  6. Prototyping
  7. Service
  8. Testing

Datasheets

Tputty 607MF Datasheet Last updated01/29/26

Technical Specification

  • Typical Properties
    Color
    Blue
    Density (g/cc)
    3.42
    Minimum Bondline Thickness (microns)
    150
    Operating Temperature Max (Celsius)
    200
    Operating Temperature Min (Celsius)
    -40
    Shelf Life
    12 months
  • Thermal Properties
    Thermal Conductivity (W/mK)
    6.20
  • Compliance
    REACH
    Yes
    ROHS Compliant
    Yes