Introducing Tflex™ CR910 two-part dispensable gap filler

Achieve high thermal conductivity and reliability in addressing large gap issues

The new Tflex™ CR910 two-part dispensable liquid gap filler provides high thermal conductivity, low thermal resistance, softness, and vertical shock and vibration resistance during assembly. Designers of automotive electronic controls, microprocessors, graphic cards, and telecom base stations often must address large device gap tolerances, yet liquid gap fillers need the reliability of gap pads. With its 9.2W/mK thermal conductivity, Tflex™ CR910 addresses those demands through its thermal properties, softness during application, and high long-term reliability.

A two-part dispensable gap filler material offering high thermal performance benefits in filling large gaps.

High thermal performance in a soft solution

Tflex™ CR910 meets stringent industry requirements including those for vertical shock and vibration, thus minimizing compression from automated application and other thermo-mechanical stresses on components. It is an ideal thermal management solution for high power automotive electronic controls, microprocessors and graphic cards, and telecom base stations.

Very high thermal conductivity of 9.2W/mK
Can be used with a range of standard automated dispensing equipment
Easily reworkable and compliant; ideal for large gaps
Meets RoHS and REACH requirements

A two-part ceramic-filled dispensable silicone gap filler for large gap applications

Mix ratio: 1:1, using off-the-shelve dispensing equipment
Flow rate at 90psa, steady state: 6g/min
Minimum bondline thickness: 200μm
Cure condition: 2 hours at 80°C, 24 hours at 23°C
Thermal resistance at1.5mm, 50°C, 40psi: 0.17 °C-in²/W
Shelf life: 6 months
Available in side-by-side 25cc cartridges with package fill volumes from 50cc to 600cc