Tputty™ 607MF Single-Part Dispensable Gap Filler
Rapid flow rate speeds a high thermal conductivity solution
The new Laird™ Tputty™ 607MF, a significant enhancement expanding upon the worldwide popularity of Tputty™ 607, aims to become the choice of teams needing higher material flow rates for applications in the automotive, telecom, and datacom industries. Its 105 grams-per-minute dispensing flow rate, 6.2W/mK thermal conductivity, high reliability in vertical applications, and softness reflect Laird’s capabilities in advanced, single-part dispensable gap fillers needed for the toughest cooling applications.
Introducing Tputty™ 607MF
Rapid flow, highly conductive, vertically stable gap filler
A dispensable gap filler ideal for high-speed automated application
Our new gap filler has been specially formulated to respond to today’s needs for high-speed assembly. Tputty™ 607MF's high material flow rate benefits manufacturing engineers seeking productivity improvements within assembly operations involving telecom base station components, graphic card chips, microprocessors, and high-power automotive electronic control devices. Its features include:
- 6.2 W/mK thermal conductivity
- Soft, ceramic-filled dispensable material with good vertical reliability and tackiness
- Lab tested 105 g/min flow rate
- Compatible with standard dispensing equipment
- Thermal cycling ability
- Easy reworking
- Meets RoHS and REACH requirements
Specifications
- -40°C to 200°C operating temperature range
- 6kV/mm dielectric breakdown voltage
- Lab tested 150 μm minimum bond line thickness
- 3.42 g/cc density
