CoolZorb™ HD500
Hybrid Thermal/EMI Absorber
Product Description
CoolZorb HD500 is a High Deflection version of the CoolZorb 500 hybrid electromagnetic absorber and thermal gap filler. The product is used like a traditional thermal gap filler between a heat source such as an IC and a heat sink or other heat transfer device or metal chassis. CoolZorb HD560 also functions to suppress unwanted energy coupling, resonances or surface currents which cause board level EMI issues. The high deflection property reduces mechanical stresses of the application, specifically targeting next gen high performance IC to avoid cracks or pin breaks.
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Industries
- 5G Data Infrastructure
- 5G Handset
- 5G Peripherals
- 5G Telecom
- Aerospace
- Automotive
- Automotive and Industrial Electronics
- Autonomous Vehicle
- Blade servers
- Cabinet Applications
- Cloud
- Commercial Telecom
- Computing
- Consumer
- Consumer Accessories
- Consumer Electronics
- Data Infrastructure
- Datacom
- Electric Vehicle
- Gaming
- Handset
- Medical
- Medical Equipment
- Military
- Mobile Devices
- Mobile Infrastructure
- Network and telecommunications equipment
- Networking
- Personal Medical Devices
- Printers
- Robotics
- Satellite
- Security and defense
- Servers
- Small consumer electronics
- Telecom
- Telecom, 5G, Consumer, Automotive, Military
- Telecom, Automotive, Other
- Telecom, consumer and general applications
- Telecommunications
- Transportation
- Video graphics
- Wearable electronics
- Wireless
Applications
- EMI Attenuation
- High Deflection
- mmWave
- Optical Module
- Thermal Transfer
Features and Benefits
- High thermal conductivity with good EMI suppression within 20-90GHz
- Inherent surface tack typical of standard thermal gap fillers
- High deflection property reduces mechanical stresses of the application, specifically to avoid cracks or pin breaks
- Meets UL 94 V-0 flame requirements
- Dual functional properties of thermal conductivity and EMI reduction provide two in one solution for easier design and assembly and lower cost of ownership
- Improved reliability performance of electronics
- Better signal integrity due to reduction of EMI
- Consistent performance of electronics due to temperature stability and low outgassing properties of product
- Improved EMC performance and resultant lower cost to meet compliance requirements
- Environmentally friendly solution that meets regulatory requirements including RoHS and REACH
Capabilities
Technical Specification
Typical Properties
ColorGreyDensity (g/cc)3.39Operating Temperature Max (Celsius)175Operating Temperature Min (Celsius)-40Outgassing CVCM (%)0.040Outgassing TML (%)0.350Electromagnetic Properties
Attenuation @10GHz (dB/cm)15.4Attenuation @20GHz (dB/cm)34.2Attenuation @28GHz (dB/cm)48.1Attenuation @39GHz (dB/cm)64.5Attenuation @77GHz (dB/cm)106.4Electrical Properties
Volume Resistivity8.80 x10^13 Ohm-cmMechanical Properties
CTE153.0Hardness (Shore 00)26Dimensions
Thickness Max (mm)2.00Thickness Min (mm)1.00Compliance
REACHYesROHS CompliantYes