Hybrid - ISE
Multi-function Solutions (MFS) / ISE (Integrated Solutions Engineered)
Merged Functionality
Laird Hybrid-ISE solutions merge thermal, EMI shielding, and microwave absorbers into a single-engineered package to meet your demands for cutting-edge products. Today’s electronics are creating more heat, are operating at higher frequencies, are needing to fit into smaller packages, and are relying on precise signals from their antennas to compete in an ever-evolving market landscape. Laird solutions are targeted directly to meet these challenges and needs.
Hybrid - ISE Sub-Groups
CoolZorb
Homogeneous compressible pad material providing thermal transfer and microwave absorber capabilities in one.
Coolshield Flex
Flexible very low height board level shield cover with superior thermal transfer abilities.
Graphite over Foam (GOF)
Compressible thermal transfer gasket enabling device insertion or heat transfer over large gaps with high thermal conductivity; with or without electrical conductivity.
Kzorb
Microwave absorber and dielectric sheet that can be applied directly to the PCB with no effect on trace impedance.