Tflex™ HD7.5
Silicone based Thermal Gap Filler
Product Description
Laird’s Tflex™ HD7.5 gap filler is a new developed very soft silicone material in our high deflection series. With a thermal conductivity of 7.5W/ mk, Tflex™ HD7.5 is designed to provide superior pressure versus deflection characteristics. The material will provide minimal stress on components during application while maintaining low thermal resistance. As a result, less mechanical and thermal stresses will be experienced within your device.
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Features and Benefits
· 7.5 W/mK thermal conductivity soft pad
· Low pressure versus deflection
· Minimizes board and component stress
· Low outgassing and oil bleeding
Capabilities
Datasheets
Tflex HD7.5 Data Sheet Last updated08/01/23Technical Specification
Typical Properties
ColorGreyDensity (g/cc)3.40Operating Temperature Max (Celsius)125Operating Temperature Min (Celsius)-40Thermal Properties
Thermal Conductivity (W/mK)7.50Thermal Resistance @10 psi Max (C-in2/W)0.133Thermal Resistance @10 psi Min (C-in2/W)0.119Thermal Resistance @30 psi Max (C-in2/W)0.087Thermal Resistance @30 psi Min (C-in2/W)0.081Thermal Resistance @50 psi Max (C-in2/W)0.083Thermal Resistance @50 psi Min (C-in2/W)0.077Electrical Properties
Dielectric Breakdown Voltage (Volts AC)6900.0Volume Resistivity1.1X10^14Mechanical Properties
Hardness (Shore 00)15Dimensions
Thickness Max (Microns)5000.0Thickness Max (inches)0.200Thickness Max (mm)5.00Thickness Min (Microns)1000.0Thickness Min (inches)0.040Thickness Min (mm)1.00Compliance
Lead FreeYesREACHYesROHS CompliantYes