Tflex™ UT20000
Ultra-thin Thermal Gap Filler
Product Description
Ultra-thin gap filler offering great thermal performance and handling. Tflex UT20000 is a specially formulated ultra-thin gap filler thermal interface material designed for thin interfaces that offers excellent thermal performance and high compliancy. It is designed without embedded reinforcing fiberglass to minimize contact resistance, yet still allows easy material handling and durability during assembly.
The elastomeric property of Tflex UT20000 provides excellent interfacing and wetting out mating surfaces in thin interface where efficiently transfer heat away from components. It is an ideal choice for low-pressure applications and optimum solution in handheld devices with thin interface gap and limited space requirements.
Tflex UT20000 is electrically non-conductive, stable from -40°C thru 200°C and offered in thicknesses that range from 0.008 inches (0.2mm) up to 0.040 inches (1.0mm).
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Industries
- Aerospace/Defense
- Automotive
- Consumer
- Industrial
- Telecom/Datacom
Applications
- Automotive ADAS
- Automotive Electronics
- Automotive Infotainment
- Automotive Powertrain/ECUs
- Drones/Satellites
- Gaming Systems
- Instrumentation
- Notebooks/Tablets/Portable Devices
- Routers
- Smart Home Devices
- Wireless infrastructure
Features and Benefits
- No fiberglass carrier to minimize thermal resistance, yet still easy to handle
- Excellent surface wetting for low contact resistance
- Unique formulation minimizes thermal resistance at low mounting forces
- Environmentally friendly solution that meets regulatory requirements including RoHS and REACH
Capabilities
Datasheets
Tflex UT20000 Datasheet Last updated12/15/21Technical Specification
Typical Properties
ColorGreyDensity (g/cc)3.20Operating Temperature Max (Celsius)200Operating Temperature Min (Celsius)-50Outgassing CVCM (%)0.090Outgassing TML (%)0.340Shelf Life2 years from Date of ShipmentThermal Properties
Thermal Conductivity (W/mK)3.00Thermal Resistance @10 psi Max (C-in2/W)0.502Thermal Resistance @10 psi Min (C-in2/W)0.172Thermal Resistance @30 psi Max (C-in2/W)0.465Thermal Resistance @30 psi Min (C-in2/W)0.132Thermal Resistance @50 psi Max (C-in2/W)0.434Thermal Resistance @50 psi Min (C-in2/W)0.124Electrical Properties
Dielectric Constant5.90Volume Resistivity2.20 x10^15 Ohm-cmMechanical Properties
Hardness (Shore 00)56Dimensions
Thickness Max (Microns)1000.0Thickness Max (inches)0.040Thickness Min (Microns)200.0Thickness Min (inches)0.008Compliance
REACHYesROHS CompliantYes