Tflex™ B200
Silicone based Thermal Gap Filler
Product Description
Tflex B200 is a reliable, compliant thermal interface material offering good thermal performance and easy handling and features a range of multiple surface and re-enforcement options for a variety of applications. This gap filler's low modulus and softness relieves mechanical stress.
Tflex B200 helps absorb shock, resulting in improved device reliability over the long term. It has high dielectric insulation which works to protect against dielectric breakdown in or between devices. Tflex B200 as a standard product is naturally tacky on both sides and requires no additional adhesive coating that would inhibit thermal performance.
Tflex B200MFG, an option with a fiberglass layer in the middle, has high tensile strength maintaining the natural tack properties on both sides. This helps prevent deforming during manual or automated assembly.
Tflex B200FG, an option with a fiberglass layer re-enforcement on one side. This option will have better deflection than the B200MFG option, and provides protection close to one side.
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Industries
- Aerospace/Defense
- Automotive
- Consumer
- Industrial
- Telecom/Datacom
Applications
- Automotive ADAS
- Automotive Electronics
- Automotive Infotainment
- Automotive Powertrain/ECUs
- Drones/Satellites
- Gaming Systems
- Instrumentation
- Notebooks/Tablets/Portable Devices
- Routers
- Smart Home Devices
- Wireless infrastructure
Features and Benefits
- Compliant during application
- Long term reliability
- Shock resistance in automotive
- Fiberglass re-enforcement options to protect from breakthrough or deformation
Capabilities
Datasheets
Tflex B200 Datasheet Last updated06/16/21Technical Specification
Typical Properties
ColorGreyDensity (g/cc)2.20Operating Temperature Max (Celsius)150Operating Temperature Min (Celsius)-40Outgassing CVCM (%)0.070Outgassing TML (%)0.320Shelf Life2 years from Date of ShipmentThermal Properties
Thermal Conductivity (W/mK)2.00Thermal Resistance @10 psi Max (C-in2/W)3.144Thermal Resistance @10 psi Min (C-in2/W)0.732Thermal Resistance @30 psi Max (C-in2/W)2.759Thermal Resistance @30 psi Min (C-in2/W)0.662Thermal Resistance @50 psi Max (C-in2/W)2.480Thermal Resistance @50 psi Min (C-in2/W)0.616Electrical Properties
Volume Resistivity2.00 x10^13 Ohm-cmMechanical Properties
Hardness (Shore 00)42Dimensions
Thickness Max (inches)0.200Thickness Max (mm)5.08Thickness Min (inches)0.040Thickness Min (mm)1.02Compliance
REACHYesROHS CompliantYes