Tputty™ 910
One Part Liquid Dispensable Gap Filler
Product Description
With 9.1W/m.K thermal conductivity, Tputty™ 910 is at the forefront of thermal performance of liquid gap filler. It is one-part dispensable gap filler, ready-to-use, not requiring any curing operation.
Tputty™ 910 is a soft, compliant, high thermal conductivity dispensable gap filler providing lowest thermal resistance and highest reliability available.
Tputty™ 910 is a soft, compliant, high thermal conductivity dispensable gap filler providing lowest thermal resistance and highest reliability available.
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Industries
- Automotive and Industrial Electronics
- Servers
- 5G Data Infrastructure
Applications
- Automotive Powertrain/ECUs
- Automotive Electronics
- Base station/Power amplifier/Acitve antenna unit /small cell
- Servers
- Optical Module
Features and Benefits
- Thermal conductivity 9.1W/mK
- dispensable and compliant
- easily reworkable
- ideal for large and small gaps
- meets RoHS and REACH requirements
Capabilities
Datasheets
Tputty 910 Datasheet Last updated05/16/25Technical Specification
Typical Properties
Colorlight redDensity (g/cc)3.20Minimum Bondline Thickness (microns)180Operating Temperature Max (Celsius)180Operating Temperature Min (Celsius)-40Shelf Life6 monthsThermal Properties
Thermal Conductivity (W/mK)9.10