Tpli™ 200
Silicone based Thermal Gap Filler
Product Description
Tpli 200 is an Exceptionally Soft, Highly Compressible Gap Filler premium gap filler. Tpli 200's exceptional combination of high thermal conductivity and compliancy generate unmatched thermal resistances in a gap filling interface material. Tpli 200 absorbs shock and relieves stresses, thus minimizing potential damage to components. Tpli 200 is electrically insulating, stable from -45°C to 200°C, and meets UL 94 HB rating
Product Video
Image Gallery
Industries
- Aerospace/Defense
- Automotive
- Consumer
- Industrial
- Telecom/Datacom
Applications
- Automotive ADAS
- Automotive Electronics
- Automotive Infotainment
- Automotive Powertrain/ECUs
- Drones/Satellites
- Gaming Systems
- Instrumentation
- Notebooks/Tablets/Portable Devices
- Routers
- Smart Home Devices
- Wireless infrastructure
Features and Benefits
- Low Dielectric Constant
- High thermal performance
Capabilities
Datasheets
Tpli 200 Datasheet Last updated07/13/22Technical Specification
Typical Properties
ColorVariesDensity (g/cc)1.40Operating Temperature Max (Celsius)200Operating Temperature Min (Celsius)-45Outgassing CVCM (%)0.150Outgassing TML (%)0.460Shelf Life2 years from Date of Shipment , 1 year if Adhesive if addedThermal Properties
Thermal Conductivity (W/mK)6.00Thermal Resistance @10 psi Max (C-in2/W)0.597Thermal Resistance @10 psi Min (C-in2/W)0.339Thermal Resistance @30 psi Max (C-in2/W)0.441Thermal Resistance @30 psi Min (C-in2/W)0.244Thermal Resistance @50 psi Max (C-in2/W)0.392Thermal Resistance @50 psi Min (C-in2/W)0.188Electrical Properties
Dielectric Constant3.20Volume Resistivity5.00 x10^13 Ohm-cmMechanical Properties
Hardness (Shore 00)70Dimensions
Thickness Max (inches)0.200Thickness Max (mm)5.08Thickness Min (inches)0.010Thickness Min (mm)0.25Compliance
REACHYesROHS CompliantYes