Tlam™ PP HTD

Tlam™ is a thermally conductive IMPCB substrate used for heat dissipation in electronics circuit boards used in Power Supplies, DC-DC Converters, LEDs & Ballast Lighting, Automotive, Appliances, Commercial & Industrial Motor Drives, and Military & Aerospace Applications.

The heart of this system is the thermally conductive pre-preg, Tlam™ PP HTD.  This ceramically filled 2.2 W/mK, dielectric prepreg offers 8 times better thermal performance over FR4, while maintaining good adhesion and voltage breakdown properties.  Tlam™ PP HTD is a “B” State epoxy film providing room temperature stability for 6 months.  Tlam™ PP HTD is provided in multiple thicknesses.  Thinner films offer better thermal performance while thicker films offer better dielectric strength.

Tlam™ PP HTD can be used to build many different combinations of PCB laminates.   The simplest is copper foil, Tlam™ PP HTD dielectric and an aluminum base plate which acts as a heatsink and adds rigidity. Board complexity goes up from here offering multi-layer boards constructions and PCB structures can further include varying layers of Tlam™ PP HTD and FR4 layers to give the thermal properties where need while maintaining cost effectiveness.

Tlam™ PP HTD can laminated with copper foils from ½ oz to 4 oz can be used aluminum or copper base plates ranging from 2.5mm to 6mm thick.  Further Tlam™ PP HTD and be laminated on both sides with copper films to make traditional type PCB Cores.