Tflex™ SF4
Non-Silicone Based Thermal Gap Filler
Product Description
Tflex SF4 is an innovative, high performing thermal material in Laird's non-silicone based formulation gap filler portfolio. The non-silicone based formulation provides products with excellent deflection properties, providing minimal pressure on components during deflection. Very little pressure is required to reach the lowest possible thermal resistance. Thickness ranges from 0.5mm (0.020") to 4mm (0.160") in 0.5mm (0.020") increments available as standard.
Product Video
Industries
- Aerospace/Defense
- Automotive
- Consumer Electronics
- Datacom
- Industrial Electronics
- Telecom
Applications
- Automotive ADAS
- Graphic Cards
- Instrumentation
- Optical Module
- Routers
- Servers
Features and Benefits
- Non-silicone Based Formulation
- Low Peak and Residual Pressure
- Excellent surface wetting for low contact resistance
- Low Thermal Resistance
- UL V0 Flammability Rating
- Environmentally friendly solution that meets regulatory requirements including RoHS and REACH
Capabilities
Technical Specification
Typical Properties
ColorGreyDensity (g/cc)3.10Operating Temperature Max (Celsius)125Operating Temperature Min (Celsius)-65Shelf Life2 years from Date of ShipmentThermal Properties
Thermal Conductivity (W/mK)4.00Thermal Resistance @10 psi Max (C-in2/W)0.082Thermal Resistance @10 psi Min (C-in2/W)0.074Thermal Resistance @30 psi Max (C-in2/W)0.078Thermal Resistance @30 psi Min (C-in2/W)0.070Thermal Resistance @50 psi Max (C-in2/W)0.074Thermal Resistance @50 psi Min (C-in2/W)0.067Electrical Properties
Dielectric Breakdown Voltage (Volts AC)7.5Volume Resistivity5 x 10^13Mechanical Properties
Hardness (Shore 00)40Dimensions
Thickness Max (Microns)4000.0Thickness Max (inches)0.160Thickness Max (mm)4.00Thickness Min (Microns)500.0Thickness Min (inches)0.020Thickness Min (mm)0.50Compliance
Lead FreeYesREACHYesROHS CompliantYes