Tpcm™ 200SP

Screen Printable Phase Change Material

Product Description

TpcmTM 200SP is a non-silicone based formulation, thermal phase change material (PCM) designed to meet the thermal reliability and outgassing requirements of LED lighting applications, while offering a low total cost of ownership. It is specifically designed for use in various optical applications such as automotive headlamps, LED lighting, cameras, lasers and sensors. TpcmTM 200SP is also well suited for the broader market where the thermal requirements are moderately demanding. Tpcm 200SP is a screen printable phase change material which quickly dries to the touch so that it can be pre-applied to components for future assembly.
TPCM SP Primary Image

Industries

  1. Consumer
  2. Telecom/Datacom

Applications

  1. Graphic Cards
  2. Hard Disk Drives
  3. IGBTs
  4. Memory Modules
  5. Notebooks/Tablets/Portable Devices
  6. Servers
  7. Smart Home Devices
  8. Wireless infrastructure

Features and Benefits

  • Non-silicone-based formulation
  • Low thermal resistance
  • Ease of use for high volume manufacturing
  • High thixotropic index
  • Re-flow compatible
  • High thermal reliability, minimal pump out

Capabilities

  1. Automated Packaging
  2. Automated Pad Placement
  3. Custom Automation
  4. Custom Product Development
  5. Modeling
  6. Prototyping
  7. Service
  8. Testing

Datasheets

Tpcm 200SP Datasheet Last updated09/11/25

Technical Specification

  • Typical Properties
    Color
    White
    Density (g/cc)
    3.20
    Minimum Bondline Thickness (microns)
    10
    Minimum Bondline Thickness (mm)
    0.01
    Operating Temperature Max (Celsius)
    125
    Operating Temperature Min (Celsius)
    -40
    Phase Change Temperature (Deg C)
    45
    Shelf Life
    6 months from Date of Shipment
  • Thermal Properties
    Thermal Conductivity (W/mK)
    1.50
    Thermal Resistance @10 psi Max (C-in2/W)
    0.070
    Thermal Resistance @10 psi Min (C-in2/W)
    0.070
    Thermal Resistance @30 psi Max (C-in2/W)
    0.048
    Thermal Resistance @30 psi Min (C-in2/W)
    0.048
    Thermal Resistance @50 psi Max (C-in2/W)
    0.027
    Thermal Resistance @50 psi Min (C-in2/W)
    0.027
  • Mechanical Properties
    Viscosity (cP)
    20000
  • Compliance
    ROHS Compliant
    Yes
    UL Flammability Rating
    V-0