HeatsinX™

Heatsink/EMI Shielding/Thermal Gap Filler System

Product Description

HeatsinX solution provides a die-cast, deep drawn, or stamped heatsink that has been enhanced for its design needs with a combination of thermal interface material, CoolZorb, Form-in-Place EMI gaskets, RF absorbers, or EMI shielding solutions. With unique automation technology developed by Laird Performance, we can ensure a cost-effective assembly, leading to a simplified sourcing structure and lower total cost of ownership for out customers.

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Industries

  1. 5G Data Infrastructure
  2. 5G Handset
  3. 5G Peripherals
  4. 5G Telecom
  5. Aerospace
  6. Automotive
  7. Automotive and Industrial Electronics
  8. Autonomous Vehicle
  9. Blade servers
  10. Cloud
  11. Commercial Telecom
  12. Computing
  13. Consumer
  14. Consumer Accessories
  15. Consumer Electronics
  16. Data Infrastructure
  17. Datacom
  18. Electric Vehicle
  19. Energy & Utilities
  20. Gaming
  21. Healthcare
  22. Healthcare / Medical
  23. Industrial
  24. Industrial Electronics
  25. Industrial Markets
  26. Industrial/Production
  27. Medical
  28. Medical Equipment
  29. Military
  30. Mobile Devices
  31. Mobile Infrastructure
  32. Network and telecommunications equipment
  33. Networking
  34. Personal Medical Devices
  35. Printers
  36. Satellite
  37. Security and defense
  38. Servers
  39. Small consumer electronics
  40. Tablets
  41. Telecom
  42. Telecom, 5G, Consumer, Automotive, Military
  43. Telecom, Automotive, Other
  44. Telecom, consumer and general applications
  45. Telecommunications
  46. Transportation
  47. Video graphics
  48. Wireless

Applications

  1. EMI Attenuation
  2. EMI Shielding
  3. Environmental Protection
  4. mmWave
  5. Optical Module
  6. Thermal Transfer

Features and Benefits

  • Heatsink combined with Thermal Interface Material (TIM) / EMI Shielding / EMI Absorbing
  • Wide option of thermal products (automated TIM pick and place or dispensable TIM)
  • Wide option of Form-in-Place conductive gaskets
  • Automated application of Fabric over Foam conductive gaskets or conductive foam
  • Combination with CoolZorb line of products for high frequency application
  • Simulation support for complex design
  • Inhouse automation technology

Capabilities

  1. Automated Packaging
  2. Automated Pad Placement
  3. Custom Automation
  4. Custom Product Development
  5. Prototyping
  6. Service
  7. Testing

Technical Specification

  • Compliance
    REACH
    Yes
    ROHS Compliant
    Yes

Documents

HeatsinX Case Study Last updated 04/22/21