Tpcm™ 780SP
Screen Printable Phase Change Material
Product Description
Tpcm 780SP is a high performance, inherently tacky, easy to rework screen printable phase change thermal interface material. Developed specifically to meet the high thermal conductivity and low thermal resistance requirements of today'ss demanding processors. This silicone-free material is so soft that it begins to flow as the temperature is elevated by just a small amount.
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Industries
- Consumer
- Telecom/Datacom
Applications
- Graphic Cards
- Hard Disk Drives
- IGBTs
- Memory Modules
- Notebooks/Tablets/Portable Devices
- Servers
- Smart Home Devices
- Wireless infrastructure
Features and Benefits
- Silicone-free for applications that are silicone sensitive Low total thermal resistance
- Inherently tacky and easy to use, no adhesive required
- High thermal reliability
- Ease of use for high volume manufacturing
- No mess due to thixotropic characteristics which prevent flow outside of interface
Capabilities
Datasheets
Tpcm 780SP Datasheet Last updated08/17/22Technical Specification
Typical Properties
ColorGreyDensity (g/cc)2.50Minimum Bondline Thickness (microns)25Minimum Bondline Thickness (mm)0.03Operating Temperature Max (Celsius)125Operating Temperature Min (Celsius)-40Outgassing CVCM (%)0.200Outgassing TML (%)0.510Phase Change Temperature (Deg C)45Shelf Life1 year from Date of ShipmentThermal Properties
Thermal Conductivity (W/mK)5.40Compliance
ROHS CompliantYes