Thermal Interface Materials

1.2W/mK silicone based pad with high compliancy

1.2W/mK silicone based thermal pad with guarenteed dieletric barrier

2.8W/mK silicone based pad with high compliancy

3W/mK silicone based pad with low dielectric constant

3W/mK silicone based pad with low dielectric constant

The Laird™ Tflex™ B200 gap filler offers good thermal performance and handling with enforcement options for a variety of application.

2.8W/mK silicone based pad with high deflection

2.8W/mK silicone based pad with guaranteed dielectric barrier

Tflex™ HD7.5 gap filler is a new developed very soft silicone material in our high deflection series

5W/mK silicone based pad with high deflection

6W/mK silicone based pad with high deflection

7.5W/mK silicone based pad with high deflection and low oil bleed

34W/mK non-silicone based pad filled by alligned graphite fiber

6.5W/mK silicone based pad with high reconvery

3W/mK silicone based pad with high reconvery

1.2W/mK silicone based pad with guaranteed dielectric barrier

3W/mK silicone based pad with guaranteed dielectric barrier

10W/mK non-silicone based pad with high compliance

16W/mK non-silicone based pad with high compliance

4W/mK non-silicone based pad with high compliance

3W/mK non-silicone based pad

7.8W/mK non-silicone based pad with high compliance

7.8W/mK non-silicone based pad

Tflex UT20000 is an ultra-thin gap filler that offers excellent thermal performance and high compliancy.

The Laird™ Tgon™ 800 product is an electrically conductive natural graphite thermal gap filler.

The Laird™ Tpli™ 200 material is an exceptionally soft, highly compressible gap filler

3W/mK silicone based putty-like pad with high compliancy

Tgel 600 is an all-in-one dispensable that can be used in constant pressure applications (grease) and used as a thick gap filler in a constant gap

Tgrease™ 1500 thermal grease is a cost effective solution for standard thermal grease needs

Tgrease 2500 is a non-silicone based formulation thermal grease for use in high performance applications.

High Temperature Stable Thermal Grease

Tgrease 300X is a silicone-based thermal grease for use in high performance CPUs and GPU.

3.6W/mK silicone based Liquid Gap Filler

3.6W/mK silicone based Liquid Gap Filler with lower hardness

5.4W/mK silicone based Liquid Gap Filler

6.4W/mK silicone based Liquid Gap Filler

9.2W/mK silicone based Liquid Gap Filler

The Laird™ Tputty™ 403 product is one part silicone based liquid dispensable thermal gap filler that has low abrasive properties.

The Laird™ Tputty™ 508 product is one part silicone based liquid dispensable thermal gap filler with excellent thermal performance and reliability.

6.4W/mK silicone based Liquid Gap Filler

6.2W/mK silicone Liquid Gap Filler with higher fluidity

9.1W/mK silicone based Liquid Gap Filler

5.6W/mK non-silicone Liquid Gap Filler

Tpcm 200SP is a non-silicone based formulation screen printable phase change material.

Tpcm™ 5000 is designed to provide the best performance to price available.

Tpcm™ 580 phase change material is 3.8 W/mK and designed to meet the thermal reliability and price requirements of high-end thermal application.

With a thermal conductivity of 7.5 W/mK, Tpcm™ 7000 is designed to enhance the cooling of the most rigorous thermal challenges in electronics

Tpcm™ 7000Plus is enhanced version or Tpcm 7000 requiring lower temperature burn-in (melt/flow),

Tpcm™ 780 phase change material at 5.5 W/mK, is a high performance phase change TIM, offering low thermal resistance and excellent reliability

Tpcm™ 780SP phase change material at 5.5 W/mk, is a high performance screen printable phase change material.

Tpcm™ 900 phase change material is a naturally tacky phase change offering reliable thermal performance.

Tpcm AL52 is a thermally conductive phase change material coated on both sides of aluminum foil.

Homogeneous compressible pad material providing thermal transfer and microwave absorber capabilities in one; 2 W/mK

Homogeneous compressible pad material providing thermal transfer and microwave absorber capabilities in one; 2 W/mK

Homogeneous compressible pad material providing thermal transfer and microwave absorber capabilities in one; 4 W/mK

Homogeneous high deflection pad material providing thermal transfer and microwave absorber capabilities in one; 3 W/mK

Homogeneous compressible non-silicone based pad material providing thermal transfer and microwave absorber capabilities in one; 11.5 W/mK

Compressible thermal transfer gasket enabling device insertion or heat transfer over large gaps with high thermal conductivity

Compressible thermal transfer gasket enabling device insertion or heat transfer over large gaps with high thermal conductivity

Electrically and thermally conductive foam gasket for space sensitive designs or efficient large gap size heat transfer with grounding

Thermal interface solution for sliding applications and datacenter pluggable modules.

The Laird™ Tgon™ 800 product is an electrically conductive natural graphite thermal gap filler.

High Performance Thermally Conductive Adhesive Tape

The Tgard™ 6000 series is a high-performance electrically insulating material.

High performance insulator consisting of fiberglass reinforced silicone pad

Tgard™ 300 is a medium thermal performance insulator pad

Medium thermal performance insulator pad

Good dielectric material consisting of a polyimide film coated with thermal silicone rubber.

High-performance electrically insulating PI film

High thermal and dielectric performance insulating PI film

High thermal and dielectric performance insulator consisting of coated phase change compound

Heat curable epoxy film with thermally conductive and electrically insulating performance

Thermally Conductive Pre-Preg

Thermally Conductive Pre-preg