Tflex™ HP34
High Performance Gap Filler
Product Description
Tflex™ HP34 is an exceptional gap filler product with a thermal conductivity of 34 W/mK. Tflex HP34 is a non silicone formulation containing aligned graphite materials. Compared to typical graphite-based materials, Tflex HP34 is considerably softer with excellent deflection properties.
Product Video
Image Gallery
Industries
- 5G Data Infrastructure
- 5G Telecom
- Data Infrastructure
- Aerospace/Defense
- Automotive
- Datacom
- Consumer Electronics
- Servers
Applications
- 5G Antenna Radome
- Wireless infrastructure
- Routers
- Servers
- Instrumentation/Test and measure
- Notebooks/Tablets/Portable Devices
- Smart Home Devices
- Telecom cabinets
Features and Benefits
- 34 W/mK bulk thermal conductivity
- Silicone Free formulation
- Maintains thermal performance under increased pressure
- Low contact resistance with mating surfaces
- Environmentally friendly solution that meets RoHS and REACH