Product Announcement

NEW RELEASE
our new NON-SILICONE high-performance liquid gap filler 

Tputty™ SF560

Non-silicone liquid gap filler

Product Description

Tputty™SF560 is a high-performance single component dispensable gap filler. It is designed to offer a thermal conductivity in the 5-6W range, along with good thermal resistance. As a non-silicone based formulation, it's softness will best suit automotive applications which require low compressive forces and are sensitive to volatile silicone molecules or silicone oil bleeding.

Industries

  1. Automotive and Industrial Electronics
  2. Autonomous Vehicle
  3. Industrial Electronics

Applications

  1. Automotive ADAS
  2. Automotive Lighting
  3. Automotive Infotainment
  4. Digital cameras
  5. Radar

Features and Benefits

  • Non-silicone based formulation
  • Thermal Conductivity 5.6W/mK
  • Dispensable and Compliant
  • Easily reworkable
  • Meets RoHS and REACH requirements
  • Very low fogging
  • Elevated temperature resistance

Capabilities

  1. Automated Packaging
  2. Automated Pad Placement
  3. Custom Automation
  4. Custom Product Development
  5. Modeling
  6. Prototyping
  7. Service
  8. Testing

Datasheets

Tputty SF560 Datasheet Last updated09/11/25

Technical Specification

  • Typical Properties
    Color
    grey
    Density (g/cc)
    3.40
    Minimum Bondline Thickness (microns)
    150
    Minimum Bondline Thickness (mm)
    0.15
    Operating Temperature Max (Celsius)
    150
    Operating Temperature Min (Celsius)
    -40
    Outgassing CVCM (%)
    0.010
    Outgassing TML (%)
    0.030
    Shelf Life
    6 months
  • Compliance
    Lead Free
    Yes
    REACH
    Yes
    ROHS Compliant
    Yes
    UL Flammability Rating
    V0