Tflex 300TG
Silicone based Thermal Gap Filler
Product Description
The high rate of compliancy of Tflex 300TG allows the material to totally blanket the component, enhancing thermal transfer. The material has a very low compression set enabling the pad to be reused many times. Tflex 300TG, in achieving its stellar compliancy, does not sacrifice thermal performance. With a thermal conductivity of 1.2 W/mK, low thermal resistance can be achieved at low pressures. A Tgard silicone liner has been added to the Tflex 300TG to offer a guaranteed
dielectric barrier. The Tgard is cut-through resistant and provides easier part handling in mass production.
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Industries
- Aerospace/Defense
- Automotive
- Consumer
- Industrial
- Telecom/Datacom
Applications
- Automotive ADAS
- Automotive Electronics
- Automotive Infotainment
- Automotive Powertrain/ECUs
- Drones/Satellites
- Gaming Systems
- Instrumentation
- Notebooks/Tablets/Portable Devices
- Routers
- Smart Home Devices
- Wireless infrastructure
Features and Benefits
- Extreme compliancy allows material to “totally blanket” component(s)
- Low compression set enables the pad to be reused many times
- Provides a dielectric barrier
Capabilities
Datasheets
Tflex 300TG Datasheet Last updated04/22/21Technical Specification
Typical Properties
ColorLight GreenDensity (g/cc)1.80Operating Temperature Max (Celsius)160Operating Temperature Min (Celsius)-40Outgassing CVCM (%)0.100Outgassing TML (%)0.560Reinforcement CarrierTgardShelf Life2 years from Date of ShipmentThermal Properties
Thermal Conductivity (W/mK)1.20Electrical Properties
Dielectric Constant4.50Volume Resistivity1.00 x10^13 Ohm-cmMechanical Properties
Hardness (Shore 00)27Dimensions
Thickness Max (inches)0.200Thickness Max (mm)5.00Thickness Min (inches)0.020Thickness Min (mm)0.51Compliance
REACHYesROHS CompliantYes