Tflex™ 300TG
Silicone based Thermal Gap Filler
Product Description
The high rate of compliancy of Tflex 300TG allows the material to totally blanket the component, enhancing thermal transfer. The material has a very low compression set enabling the pad to be reused many times. Tflex 300TG, in achieving its stellar compliancy, does not sacrifice thermal performance. With a thermal conductivity of 1.2 W/mK, low thermal resistance can be achieved at low pressures. A Tgard silicone liner has been added to the Tflex 300TG to offer a guaranteed
dielectric barrier. The Tgard is cut-through resistant and provides easier part handling in mass production.
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Industries
- Aerospace/Defense
- Automotive
- Consumer
- Industrial
- Telecom/Datacom
Applications
- Automotive ADAS
- Automotive Electronics
- Automotive Infotainment
- Automotive Powertrain/ECUs
- Drones/Satellites
- Gaming Systems
- Instrumentation
- Notebooks/Tablets/Portable Devices
- Routers
- Smart Home Devices
- Wireless infrastructure
Features and Benefits
- Extreme compliancy allows material to “totally blanket” component(s)
- Low compression set enables the pad to be reused many times
- Provides a dielectric barrier
Capabilities
Datasheets
Tflex 300TG Datasheet Last updated04/22/21Technical Specification
Typical Properties
ColorLight GreenDensity (g/cc)1.80Operating Temperature Max (Celsius)160Operating Temperature Min (Celsius)-40Outgassing CVCM (%)0.100Outgassing TML (%)0.560Reinforcement CarrierTgardShelf Life2 years from Date of ShipmentThermal Properties
Thermal Conductivity (W/mK)1.20Electrical Properties
Dielectric Constant4.50Volume Resistivity1.00 x10^13 Ohm-cmMechanical Properties
Hardness (Shore 00)27Dimensions
Thickness Max (inches)0.200Thickness Max (mm)5.00Thickness Min (inches)0.020Thickness Min (mm)0.51Compliance
REACHYesROHS CompliantYes