Tlam PP 1KA

Tlam™ is a thermally conductive IMPCB substrate used for heat dissipation in electronics circuit boards used in Power Supplies, DC-DC Converters, LEDs & Ballast Lighting, Automotive, Appliances, Commercial & Industrial Motor Drives, and Military & Aerospace Applications.

The heart of this system is the thermally conductive pre-preg, Tlam PP KA.  This ceramically filled 3 W/mK, dielectric prepreg offers 8-10 times better thermal performance over FR4, while maintaining good adhesion and voltage breakdown properties. Tlam PP 1KA is a “B” State epoxy film providing room temperature stability for 6 months. Tlam PP 1KA is provided in multiple thicknesses.  Thinner films offer better thermal performance while thicker films offer better dielectric strength.

Tlam PP 1KA can be used to build many different combinations of PCB laminates.   The simplest is copper foil, Tlam PP 1KA dielectric and an aluminum base plate which acts as a heatsink and adds rigidity. Board complexity goes up from here offering multi-layer boards constructions and PCB structures can further include varying layers of Tlam PP 1KA and FR4 layers to give the thermal properties where need while maintaining cost effectiveness.

Tlam PP 1KA can laminated with copper foils from ½ oz to 4 oz can be used aluminum or copper base plates ranging from 2.5mm to 6mm thick.  Further Tlam PP 1KA and be laminated on both sides with copper films to make traditional type PCB Cores.