Tpcm™ 5000
Thermal Phase Change Material
Product Description
Tpcm™ 5000 is a new high-performance TIM in the Laird product offering. Tpcm™ 5000 is designed to provide the best performance to price available. Tpcm™ 5000 provides very low thermal resistance by coupling high thermal conductivity of 5.3 W/mK, minimal bondline thickness, and with superior wetting of the mating surfaces. Softening between 50°C – 70°C, the initial pad thickness can decrease to a bondline as thin as 25µm. Tpcm™ 5000 reliability has been demonstrated though exposure to 1000 hours of various aging tests resulting in proven dependability at an operating temperature of 125°C. The specialty polymeric matrix offers superior pump out resistance when compared to thermally conductive greases and other phase change materials. Tpcm™ 5000 has been formulated to provide just the right tack, remaining on liners yet easily removeable for application.
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Industries
- Automotive
- Computing
- Consumer
- Datacom
- Electric Vehicle
- Industrial Electronics
- Medical Equipment
- Satellite
- Servers
- Telecommunications
- Video graphics
Applications
- Automotive Infotainment
- Computer servers
- Graphic Cards
- IGBTs
- Notebooks/Tablets/Portable Devices
- Power Converters
- Power Supplies
Features and Benefits
- 5.3 W/mK bulk thermal conductivity
- Cost effective
- Non silicone formulation that provides naturally tacky surface
- Fully characterized long term reliability
- No pump out
- Easy rework