CoolShield™ R

EMI Shielding/Thermal Gap Filler System

Product Description

CoolShield solution integrates thermal products in to board level shielding covers so that they can provide both EMI shielding and heat transmission for ICs on electronics devices. Here, shielding cover can be a piece of stamped metal, a deep draw cover or even a die casting part while thermal product can vary according to application requirement including thermal gap filler, thermal grease, thermal Gel, phase change material, etc. With unique automation technology developed by Laird Performance, we can ensure a cost-effective assembly.

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Industries

  1. 5G Data Infrastructure
  2. 5G Handset
  3. 5G Peripherals
  4. 5G Telecom
  5. Aerospace
  6. Automotive
  7. Automotive and Industrial Electronics
  8. Autonomous Vehicle
  9. Blade servers
  10. Cabinet Applications
  11. Cloud
  12. Commercial Telecom
  13. Computing
  14. Consumer
  15. Consumer Accessories
  16. Consumer Electronics
  17. Data Infrastructure
  18. Datacom
  19. Electric Vehicle
  20. Energy & Utilities
  21. Gaming
  22. General applications
  23. Handset
  24. Healthcare
  25. Healthcare / Medical
  26. Industrial
  27. Industrial Electronics
  28. Industrial Markets
  29. Industrial/Production
  30. Medical
  31. Medical Equipment
  32. Military
  33. Mobile Devices
  34. Mobile Infrastructure
  35. Network and telecommunications equipment
  36. Networking
  37. Personal Medical Devices
  38. Printers
  39. Robotics
  40. Satellite
  41. Security and defense
  42. Servers
  43. Small consumer electronics
  44. Switch mode power supplies, electrical power generators, UPS unit
  45. Tablets
  46. Telecom
  47. Telecom, 5G, Consumer, Automotive, Military
  48. Telecom, Automotive, Other
  49. Telecom, consumer and general applications
  50. Telecommunications
  51. Test & Measure
  52. Transportation
  53. Video graphics
  54. Wearable electronics
  55. Wireless

Applications

  1. EMI Shielding
  2. Low Height Shielding
  3. Thermal Transfer

Features and Benefits

  • Shielding cover combined with Thermal Interface Material (TIM)
  • Wide option of thermal products
  • Silicone free available
  • Simulation support for complex design
  • Inhouse automation technology

Capabilities

  1. Automated Packaging
  2. Automated Pad Placement
  3. Custom Automation
  4. Custom Product Development
  5. Prototyping
  6. Service
  7. Testing

Datasheets

CoolShield R Datasheet Last updated04/22/21

Technical Specification

  • Dimensions
    Thickness Max (mm)
    1.50
    Thickness Min (mm)
    1.50
  • Compliance
    REACH
    Yes
    ROHS Compliant
    Yes
Showing 2 (of 2) Parts
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Part NumberPart NameLength (mm)Width(mm)Height (mm)MaterialThickness - Nominal (mm)Thermal Conductivity (W/mK)Deflection at 50 psi (%)
BMIS203CT072060Shieldzorb BMI-S-203 with Tflex HD90000
26.67
27.00
2.00
Tflex HD90000
1.50
7.50
78.00
Datasheet
0 distributors
BMIS202CT072060Shieldzorb BMI-S-202 with Tflex HD90000
6.96
7.00
2.00
Tflex HD90000
1.50
7.50
78.00
Datasheet
0 distributors