CoolShield R
Metal - ISE
Board level shield cover with pre-applied thermal transfer material.
EMI Shielding/Thermal Gap Filler System
Laird’s CoolShield solution integrates thermal products into board level shielding covers so that they can provide both EMI shielding and heat transmission for ICs on electronics devices. Here, the shielding cover can be a piece of stamped metal, a deep draw cover or even a die casting part while the thermal management product can vary according to application requirements including thermal pads, thermal grease, thermal gel, phase change material, etc. With unique, Laird-developed automated application technologies, we can ensure a cost-effective assembly.
