Eccostock™ FFP

Eccostock™ FFP

Product Description

ECCOSTOCK FFP is designed to infiltrate densely populated electronic packages, readily filling void space around components when vibrated in place. It can be used to stabilize crystal oscillators as well as other delicate components that need to be held in place or thermally and vibration protected.

Eccostock FFP Dielectric

Industries

  1. Aerospace/Defense
  2. Healthcare / Medical

Applications

  1. Medical diagnostic

Features and Benefits

  • Light weight
  • Low shrinkage
  • Thermal insulation
  • One part curing system
  • Low loss dielectric

Capabilities

  1. Automated Pad Placement
  2. Automated Packaging
  3. Custom Automation
  4. Custom Product Development
  5. Modeling
  6. Prototyping
  7. Service
  8. Testing

Datasheets

RFP-DS-Eccostock FFP 180620 Last updated01/27/21

Technical Specification

  • Typical Properties
    Color
    white
    Density (g/cc)
    0.24
    Function
    Dielectric
    Operating Temperature Max (Celsius)
    175
    Operating Temperature Min (Celsius)
    -65
    Resin
    Epoxy
    Shelf Life
    Minimum 720 Days from Date of Shipment
    Type
    Low Loss Dielectric curing
  • Thermal Properties
    Thermal Conductivity (W/mK)
    0.05
  • Electromagnetic Properties
    Loss Tangent
    0.00500
  • Electrical Properties
    Dielectric Constant
    1.30
    Dielectric Constant Max
    1.25
    Dielectric Constant Min
    1.25
    Dielectric strength (Kv/mm)
    2.5
    Volume Resistivity
    3.49 x10^11 Ohm-cm
  • Compliance
    Lead Free
    Yes
    REACH
    Yes
    ROHS Compliant
    Yes
Showing 5 (of 5) Parts
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Part NumberPart NameFunctionDielectric ConstantLoss TangentResinDensity (g/cc)Operating Temperature Max (Celsius)Thermal Conductivity (W/mK)REACHType
33016004FFP 6LB PL- 5 GAL; ECCOSTOCK
Dielectric
1.25
0.01
Epoxy
0.24
175.00
0.05
Yes
Low Loss Dielectric curing
Datasheet
5 distributors
33016003FFP 1.0Lb GAL; ECCOSTOCK
Dielectric
1.25
0.01
Epoxy
0.24
175.00
0.05
Yes
Low Loss Dielectric curing
Datasheet
6 distributors
33016002FFP 4.2oz (QT CAN); ECCOSTOCK
Dielectric
1.25
0.01
Epoxy
0.24
175.00
0.05
Yes
Low Loss Dielectric curing
Datasheet
5 distributors
33016001FFP 4.2oz QT SQ BOT; ECCOSTOCK
Dielectric
1.25
0.01
Epoxy
0.24
175.00
0.05
Yes
Low Loss Dielectric curing
Datasheet
5 distributors
33016000FFP 2.1 OZ PINT SQUE; BOTTLE ECCOSTOCK
Dielectric
1.25
0.01
Epoxy
0.24
175.00
0.05
Yes
Low Loss Dielectric curing
Datasheet
6 distributors

Documents

Absorber Commercial Brochure Last updated 05/28/24