Multi-function Solutions (MFS)

  • Advanced Sensor
  • EMI Shielding and RF Absorber
    • ShieldZorb™

      Board level shield cover with RF Absorber preventing EMI Challenges in mmWave range

  • EMI Shielding and Thermal Interface Materials
    • CoolShield™ Flex

      Flexible very low height board level shield cover with superior thermal transfer abilities

    • CoolShield™ R

      Board level shield cover with pre-applied thermal transfer material

    • HeatsinX™

      Advanced die-cast, deep drawn, or stamped heatsink enhanced with TIM / CoolZorb™ /FIP /EMI Shielding/RF Absorber solutions

  • Engineered Thermoplastic
    • Eccosorb™ JCP PA

      The Laird™ Eccosorb™ JCP PA compound is an injection molded absorber grade based on a polyamide thermoplastic matrix covering frequencies above 35Ghz.

    • Eccosorb™ JCP PBT 252

      The Laird™ Eccosorb™ JCP-PBT-252 compound is an injection molded absorber grade based on a PBT thermoplastic matrix covering frequencies above 35Ghz.

    • Eccosorb™ JCP-PP9

      The Laird™ Eccosorb™ JCP-PP9 compound is an injection molded absorber grade based on a proprietary blended polypropylene based material.

    • Eccosorb™ MF

      The Laird™ Eccosorb™ MF platform is a series of rigid magnetically loaded epoxy stock.

    • Eccosorb™ MF-LCP-115

      Eccosorb™ MF-LCP-115 is a Liquid Crystal Polymer-based and magnetic loaded absorber for injection molding. Working frequency covering 5GHz to 40GHz.

    • Eccosorb™ MF-PA

      The Laird™ Eccosorb™ MF-PA compound is a high temperature,magnetically loaded, polyamide thermoplastic absorber covering 1 to 35 Ghz frequency range.

    • Eccosorb™ MF-PP

      The Laird™ Eccosorb™ MF-PP compound is a magnetically loaded polypropylene thermoplastic absorber covering 1 to 35 Ghz frequency range.

    • Eccosorb™ MF-PPS

      The Laird™ Eccosorb™ MF-PPS compound is a reflow compliant, polyphenylene sulfide thermoplastic absorber covering 1 to 35 Ghz frequency range..

    • Eccosorb™ MF-TPE

      The Laird™ Eccosorb™ MF-TPE compound is a flexible, magnetically loaded, thermoplastic elastomer absorber covering 1 to 35 Ghz frequency range.

    • Eccosorb™ MF500

      The Laird™ Eccosorb™ MF500F platform is a series of high temperature rigid, magnetically loaded epoxy.

    • Radome Auto

      Injection molded radome with signal enhancing RF absorber skirt for automotive applications

    • ReZorb™

      The Laird™ ReZorb™ product is a tuned injection molded material with specific geometry surface system to achieve significant radar signal reflection reduction.

  • Specialty TIM
    • CoolZorb
      • CoolZorb™ 200

        Homogeneous compressible pad material providing thermal transfer and microwave absorber capabilities in one; 2 W/mK

      • CoolZorb™ 400

        Homogeneous compressible pad material providing thermal transfer and microwave absorber capabilities in one; 2 W/mK

      • CoolZorb™ 500

        Homogeneous compressible pad material providing thermal transfer and microwave absorber capabilities in one; 4 W/mK

      • CoolZorb™ 600

        Homogeneous compressible pad material providing thermal transfer and microwave absorber capabilities in one; 3 W/mK

      • CoolZorb™ D 3W/1K

        One part silicone based dispensable material provide both thermal transfer and microwave absorbing capabilities. Thermal conductivity is 3W/m.k.

      • CoolZorb™ HD500

        Homogeneous high deflection pad material providing thermal transfer and microwave absorber capabilities in one; 3 W/mK

      • CoolZorb™-MaxZorb

        Homogeneous silicone free pad material providing thermal transfer and enhanced microwave absorbing capabilities in one; 8.5 W/mK

      • CoolZorb™-Ultra

        Homogeneous compressible non-silicone based pad material providing thermal transfer and microwave absorber capabilities in one; 11.5 W/mK

    • Coolshield Flex
    • Graphite over Foam (GOF)
      • GOF1000

        Compressible thermal transfer gasket enabling device insertion or heat transfer over large gaps with high thermal conductivity

      • GOF2000

        Compressible thermal transfer gasket enabling device insertion or heat transfer over large gaps with high thermal conductivity

      • GOF3000

        Electrically and thermally conductive foam gasket for space sensitive designs or efficient large gap size heat transfer with grounding