Eccostock™ FlexK
Eccostock™ FlexK
Product Description
It weighs only about half that of polystyrene and one quarter that of polytetrafluoroethylene. FlexK LoK is waterproof and has excellent thermal characteristics, tolerating high and low temperatures. Material does not flake or shed. It s used in a variety of application from thin dielectric spacer in PCB to radome.
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Industries
- Aerospace/Defense
- Consumer
- Industrial
Applications
- Base station/Power amplifier/Acitve antenna unit /small cell
Features and Benefits
- Low dielectric constant
- Light weight and flexible
- Excellent thermal insulation and stability
Capabilities
Technical Specification
Typical Properties
ColorWhiteDensity (g/cc)0.55FunctionDielectricOperating Temperature Max (Celsius)177Operating Temperature Min (Celsius)-70Outgassing CVCM (%)0.110Outgassing TML (%)0.840ResinSiliconeShelf LifeMinimum 720 Days from Date of ShipmentTypeLow loss dielectric elastomerThermal Properties
Thermal Conductivity (W/mK)0.11Electromagnetic Properties
Loss Tangent0.00200Product Frequency Range0.1 - 10 GhzElectrical Properties
Dielectric Constant Max1.70Dielectric Constant Min1.70Dielectric strength (Kv/mm)4.0Mechanical Properties
Tensile Strength (Mpa)0.9Dimensions
Thickness Max (mm)0.50Thickness Min (mm)0.50Compliance
REACHYesROHS CompliantYesOptions
Option Availability - PSAYesOption Availability - on drawingYes