The new Tflex™ CR910 two-part dispensable liquid gap filler provides high thermal conductivity, low thermal resistance, softness, and vertical shock and vibration resistance during assembly. Designers of automotive electronic controls, microprocessors, graphic cards, and telecom base stations often must address large device gap tolerances, yet liquid gap fillers need the reliability of gap pads. With its 9.2W/mK thermal conductivity, Tflex™ CR910 addresses those demands through its thermal properties, softness during application, and high long-term reliability.
Tflex™ CR910 meets stringent industry requirements including those for vertical shock and vibration, thus minimizing compression from automated application and other thermo-mechanical stresses on components. It is an ideal thermal management solution for high power automotive electronic controls, microprocessors and graphic cards, and telecom base stations.
Designers can achieve power line noise suppression and desired power efficiency, compactness, extremely low DCR (Direct Current Resistance) at high rated currents, and consistent reliability using efficient MAF06 molded surface mount power inductors. New from Laird™ Steward™ MAF06 inductors feature a metal alloy-designed structure and new materials composition, highlighted by space-optimizing flat wire coils. In tight spaces, downsize to this smaller inductor with the assurance it can handle a similar rated current. Or continue using a metal alloy inductor but upgrade to our versatile MAF06 inductor and see it handle still higher currents. Small but rugged, MAF06 inductors offer a large current in a small size and are ideal for high reliability in temperature extremes (performance rated at 155°C) such as those faced in challenging ADAS, automotive safety, industrial, and high-end electronic applications.
MAF06 inductors offer reliable performance ideal for applications including automotive engine control unit power lines, ADAS power lines, and DC-DC power lines in telecom, datacom and industrial sectors.
Note: Heat Rated Current (lrms) is tested on a typical PCB (printed circuit board) and a constant current is applied in still air. The temperature rise is dependent on the condition of the application system including the PCB PAD pattern, trace width, and thickness and adjacent components, etc. It is suggested that users verify the temperature rise of the component under real operation application conditions.
The latest addition to Laird’s family of non-silicone based gap fillers, Tflex™ SF16 delivers industry-leading 16 W/mK thermal conductivity with exceptionally low hardness. Designed to meet the demands of next-generation data center, automotive and consumer electronics applications, Tflex™ SF16 thermal gap filler provides high thermal performance without compromising component protection or reliability. Combining high conductivity with soft material properties, low oil bleed and high reliability, Laird™ Tflex™ SF16 thermal pads are well-suited for sensitive assemblies and high-density designs.
Tflex™ SF16 is purpose-built for applications where power density is increasing and effective thermal management is critical, including data center applications such as servers, switches, and pluggable modules, as well as automotive electronic control units and computing modules. Features include:
Tflex™ HR 6.5 helps eliminate assembly compression and vibration issues. Testing of competitive gap fillers found that poor pad recovery after compression can increase thermal resistance. Mechanical stress can cause delamination and cyclic gap changes. This highly resilient, high deflection gap filler delivers 6.5 w/mK thermal conductivity. Thermal resistance showed a minimal increase after the bond line thickness was cycled 1,000 times. Tflex™ HR 6.5 retains its performance despite compression, vibration cycles, shock, or warpage.
Retain rated thermal conductivity along with low thermal resistance by implementing Tflex™ HR 6.5. This thermal pad offers resilience, high deflection force, and vibration resistance to manage thermal challenges within automotive electronics and infotainment, telecom base stations, test and measurement equipment, servers, notebooks, and portable devices.
Form-in-place grade SNN1055HSLV is an extremely low-volatile EMI shielding material for high-speed dispensing of ultra-small bead dimensions in applications such as optical transceivers. A silver/nickel filled, two-hour heat curable silicone paste, SNN1055HSLV offers 300 MHz to 40 GHz tight-fitting cavity-to-cavity shielding effectiveness. Besides its low volatility (CVCM<0.1%), the enclosure material’s balanced mechanical properties include low Shore hardness, low outgassing (TML<1%), low compression set, and excellent adhesion strength.
SNN1055HSLV mitigates optical transceiver EMI and provides benefits in other data center, aerospace, automotive, and electronics applications such as mobile phones and PCs.
The new Laird™ Tputty™ 607MF, a significant enhancement expanding upon the worldwide popularity of Tputty™ 607, aims to become the choice of teams needing higher material flow rates for applications in the automotive, telecom, and datacom industries. Its 105 grams-per-minute dispensing flow rate, 6.2W/mK thermal conductivity, high reliability in vertical applications, and softness reflect Laird’s capabilities in advanced, single-part dispensable gap fillers needed for the toughest cooling applications.
Rapid flow, highly conductive, vertically stable gap filler
Our new gap filler has been specially formulated to respond to today’s needs for high-speed assembly. Tputty™ 607MF's high material flow rate benefits manufacturing engineers seeking productivity improvements within assembly operations involving telecom base station components, graphic card chips, microprocessors, and high-power automotive electronic control devices. Its features include:
High power, high frequency pluggable optical transceivers, co-packaged optics, next-gen graphic cards, and ADAS domain controllers are among the devices encountering performance challenges caused by rising heat, EMI, and additional potential issues. Designers can overcome these obstacles and achieve compliance using new silicone-free and sulfur-free CoolZorb™-MaxZorb. This hybrid thermal/EMI material delivers impressive thermal conductivity of 8.5W/mK, CoolZorb-MaxZorb enables enhanced electromagnetic attenuation over a 3GHz to 90GHz frequency range to suppress unwanted energy coupling, resonance, or surface currents.
A High-Performance Hybrid Thermal/EMI Absorber Material
Space-saving CoolZorb™-MaxZorb™ has passed critical testing which confirms it will protect powerful, sensitive components from mounting heat and radiated emission hurdles.
*Sulfur is non-detectable according to ICP-OES testing with the test limit of 2ppm
The new AEC-Q200 qualified series of TYS 201610L, 252010L, and 252012L SMT high current, high density, low DCR power inductors become the smallest and lightest entries in the Laird™ Steward™ TYS product portfolio. Designers can select from the series’ nearly 30 surface-mount inductors, some as small as 2.0mm x 1.6mm. Their robust ferrite cores offer high saturation, ensuring reliable performance under high current conditions.
Low profiles, higher densities, and higher current handling capabilities
This micro-sized TYS series benefits ADAS and related automotive applications and more. Testing shows the series’ current-handling performance surpasses competitive inductors. Each product entry reflects wire wound construction within a magnetic shielding structure.
