Speed gap filler dispensing in automotive heat transfer scenarios

The flowability and reliability of Tflex™ CR550 make it a proven dispensable solution for large-gap and complex heat transfer challenges, providing manufacturers with cost-saving advantages.

• Dispensable two-part ceramic filled, silicone gap filler material
• 5.4W/mK thermal conductivity
• Shelf life 6 months
• High thermal and vertical reliability
• RoHS, REACH, PEFS compliant

An environmentally friendly thermal solution

• RoHS and REACH compliant
• Operating temperature range: -65°C to 150°
• Thickness: 0.5mm-4mm
• Custom thicknesses available upon request
• Density: 3.1 g/cc for Tflex™ SF4 and 3.4 g/cc for Tflex™ SF7
• Available in DF (eliminate tack from one side) and A1 (adhesive added to one side)

Product Performance

• Flow rate 8g/min
• Operating temperature range: -40°C to +200°C
• Minimum bondline thickness: 120µm
• Dielectric Breakdown Voltage: 11.9KV/mm

Remove complexity from the thermal transfer chain

BMI-S-608 is a one-part shielding solution with current applications in the automotive sector. No top-mount cover is applied to its four-sided shield frame designed to surround heat-sensitive components. Instead, the diecast/heat sink main housing is placed directly inside the shield frame and is clasped tightly by the integrated contact spring fingers. BMI-S-608 provides cost-effective EMI shielding of components while its spring fingers create electrical contact and grounding of the diecast/heat sink. The snug fit and secure sealing of the diecast housing ensures it will retain direct, surface-to-surface contact with high thermal load integrated circuits. Features, benefits, and specifications include:

• Enhanced design freedom involving PCB layout
• Permits reduction in spacing between adjacent shields
• Enables easier repairs of components 
• Alternative to multi-component manufacturer solutions
• Base materials: Stainless steel X10 CrNi18-8, (EN 1.4310)
• Surface plating/finish: Pre-plated matte tin plating: 2-5 μm
• Underlayer nickel: Minimum 1 μm
• Superior solderability and corrosion performance
• Version-Dimensions: Surface mount device frame 39,6mm  39,6mm  7mm
• Operating temperature:  -40°C up to +125°C, Short-term +150°C
• Material thickness: 0.2mm
• Flatness/Coplanarity: Typically, <0.10mm
  

A dispensable gap filler with high reliability

Given its softness and high reliability, Tflex™ CR350S is an ideal liquid gap filler solution for applications including automotive, graphic chips, microprocessors, and telecom base stations.

• 3.6W/mK thermal conductivity
• 50 Shore 00 hardness
• Easily reworkable
• Dispensable and compliant
• Meets ROHS and REACH requirements

Get Consistent Thermal Performance in a High-Temperature Solution

• 2.20 W/m-K bulk thermal conductivity
• -45°C to 180°C operating temperature range
• Thicknesses available: 0.25 mm (10 mil); 0.38 mm (15 mil); 0.45 mm (18 mil)
• Dielectric breakdown voltage > 6000
• 3 Mpa lap shear; excellent drop resistance
• 90 shore A hardness
• REACH and RoHS compliant
• Storage requirement <10°C (freezing is unnecessary)
• Shelf-life 6 months from date of manufacture when refrigerated (5°C ± 3°C)

Ensuring high performance of AI chip designs

Artificial intelligence (AI) systems and their large data sets, machine learning algorithms, and computing hardware present significant opportunities and equally huge hurdles.

AI accelerators (chips) enable the processing of vast amounts of data and perform complex computations at lightning speed. To do so they consume more power than the highest-wattage processors before them. These power levels create a larger amount of heat. A mounting concern is achieving needed cooling to efficiently eliminate excess heat.

As higher-powered AI chip designs emerge, a second and sometimes interrelated concern alongside heat is excessive electromagnetic interference. EMI has always plagued chips with high power densities. Now, increasingly powerful AI chips and extreme board densities worsen EMI concerns even more.

In applications such as data centers, long-term AI chip performance faces formidable obstacles. Several types of unwanted noise emanate from chips, ranging from the chip architecture itself through device verification. The threat EMI poses to AI chips casts a shadow across the PCB.

Slash unwanted reflection

A pure dielectric silicone absorber with no magnetic properties, ReZorb™ S becomes the smart choice in datacom/telecom, industrial, automotive, and military and aerospace applications because of the need to eliminate unwanted reflection and achieve optimum functionality of test boxes, measurement equipment, radars and scanners -- and ensure reliable measurement. Features and benefits include:

• High performance; reflection loss -25dB
• High loss
• Compact design of 4.7mm
• High mechanical properties -- shock and tear resistant
• Flexible and conformable
• Low sensitivity to dust and humidity (washable)
• Multiple angles of incidence compliant
• Interconnecting features for large surface assembly
• Optional pressure-sensitive adhesive backing and dielectric protective coating

Dampen cavity resonance - fast

The effectiveness of RobZorb™ MCS and GDS in dampening cavity resonance results from their high loss values with performance already proven from Eccosorb™ MCS and GDS, their popular equivalent elastomer sheet alternative. 1 to 1 switch is possible if designs allow. Suppress surface currents and creeping waves and reduce RF coupling too. These absorbers primarily serve the telecom, aerospace and defense, automotive, and industrial electronics industries. Features and benefits include:

• High power performance
• Self-levelling
• High magnetic loss
• Flammability UL94 V0