Tpcm™ 7000
Thermal Phase Change Material
Product Description
Tpcm™ 7000 is newest in Laird’s line of high-performance TIM product offerings. With a thermal conductivity of 7.5 W/mK, Tpcm™ 7000 is designed to enhance the cooling of the most rigorous thermal challenges in electronics. Softening between 50°C – 70°C, the initial pad thickness can decrease to a bondline as thin as 25µm.Coupled with superior wetting of the mating surfaces and displacing air, Tpcm™ 7000 provides industry leading lowest thermal resistance. Tpcm™ 7000 reliability has been demonstrated though exposure to 2000 hours of various aging tests resulting in proven dependability at an operating temperature of 150°C. The specialty polymeric matrix offers superior pump out resistance when compared to thermally conductive greases and other phase change materials. Tpcm™ 7000 has been formulated to provide just the right tack, remaining on liners yet easily removeable for application.
Product Video
Image Gallery
Industries
- Telecom/Datacom
- Computing
- Industrial Electronics
- Servers
- Video graphics
Applications
- Desktop computers
- Graphic Cards
- Notebook computers
- Gaming Systems
- Power Converters
Features and Benefits
- 7.5 W/mK bulk thermal conductivity
- No pump out
- Fully characterized long term reliability
- Non silicone based formulation that provides naturally tacky surface
- Environmentally friendly solution that meets regulatory requirements including RoHS and REACH
Capabilities
Datasheets
Tpcm 7000 Datasheet Last updated09/11/25Technical Specification
Typical Properties
Shelf Life1 year from date of shipmentThermal Properties
Thermal Conductivity (W/mK)7.50