Tflex™ 600
Silicone based Thermal Gap Filler
Product Description
EXCEPTIONALLY SOFT, HIGHLY COMPLIANT GAP FILLER
Tflex 600 is an exceptionally soft, highly compliant gap filling interface pad with a thermal conductivity of 3 W/mK. These outstanding properties are the result of a proprietary boron nitride filler in the composition.
The high conductivity, in combination with extreme softness produces incredibly low thermal resistances.
Tflex 600 is naturally tacky and requires no additional adhesive coating that can inhibit thermal performance. Tflex 600 is stable from -45°C to 200°C and meets UL 94 V0 rating.
TACKY ONE SIDE ONLYTflex 600 is naturally tacky on both sides. Tflex 600 can be provided tacky on one side only. This is indicated by the suffix DC. This option offers good separation properties allowing the tacky side to stick to the heatsink/chasis/cold plate/etc. and the other dry side to release easily from the component(s).
REINFORCEMENT
Fiberglass is required in 0.020 inch (0.51mm) and 0.030 inch (0.76mm). Thicknesses of 0.040 inch (1.02mm) and above do not require reinforcement. Data for design engineer guidance only. Observed performance varies in application. Engineers are reminded to test the material in application.
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Industries
- Aerospace/Defense
- Automotive
- Consumer
- Industrial
- Telecom/Datacom
Applications
- Automotive ADAS
- Automotive Electronics
- Automotive Infotainment
- Automotive Powertrain/ECUs
- Drones/Satellites
- Gaming Systems
- Instrumentation
- Notebooks/Tablets/Portable Devices
- Routers
- Smart Home Devices
- Wireless infrastructure
Features and Benefits
- Very high compliancy for low stress applications
- Low dielectric constant
- Naturally tacky, needs no further adhesive coating
Capabilities
Datasheets
Tflex 600 Datasheet Last updated06/07/23Technical Specification
Typical Properties
ColorBlue-VioletDensity (g/cc)1.30Operating Temperature Max (Celsius)200Operating Temperature Min (Celsius)-45Outgassing CVCM (%)0.210Outgassing TML (%)0.650Shelf Life2 years from Date of ShipmentThermal Properties
Thermal Conductivity (W/mK)3.00Thermal Resistance @10 psi Max (C-in2/W)3.440Thermal Resistance @10 psi Min (C-in2/W)1.087Thermal Resistance @30 psi Max (C-in2/W)2.089Thermal Resistance @30 psi Min (C-in2/W)0.849Thermal Resistance @50 psi Max (C-in2/W)0.956Thermal Resistance @50 psi Min (C-in2/W)0.619Electrical Properties
Dielectric Constant3.30Volume Resistivity2.00 x10^13 Ohm-cmMechanical Properties
Hardness (Shore 00)51Dimensions
Thickness Max (inches)0.200Thickness Max (mm)5.08Thickness Min (inches)0.020Thickness Min (mm)0.51Compliance
REACHYesROHS CompliantYes