Laird Technologies Expands EMI Metals Product Line with SMD Grounding Contacts
SMD Grounding Contacts Specifically Designed for Electronics Applications St. Louis, Missouri, USA – January 7, 2013 – Laird Technologies, I...
Laird Technologies Releases Two New Tflex™ Series Products
Products are High-Performance Silicone-Free Gap Fillers St. Louis, Missouri, USA – December 6, 2012 – Laird Technologies, Inc., a global lea...
Laird Technologies Introduces Board-Level Shield ReMovl™ Enhancement
Feature Allows for Detachment of Pickup Bridge St. Louis, Missouri, USA – June 26, 2012 – Laird Technologies, Inc., a global leader in the d...
Laird Technologies’ EMI Engineers Co-Author Cover Story for IN Compliance Magazine
Subject Matter Experts Discuss Advancements in Board Level Shield Design St. Louis, Missouri, USA – June 14, 2012 – Laird Technologies, Inc....
Laird Technologies Acquires Emerson & Cuming Microwave Products
Purchase expands EMI Solutions portfolio with established product brands St. Louis, Missouri, USA – March 2, 2012 – Laird Technologies, Inc....
Laird Technologies Publishes EMI Microwave Absorber Application Note
Topic Examines Microwave Absorbers for Collision Avoidance System Applications St. Louis, Missouri, USA – January 11, 2012 – Laird Technolog...
Laird Technologies Expands Electrically Conductive Elastomer Line with EcE72 Silicone Gasket
Gasket Provides Strong EMI Shielding and Environmental Sealing St. Louis, Missouri, USA – September 27, 2011 – Laird Technologies, Inc., a g...
Laird Technologies Launches Interactive EMI Shielding Effectiveness Calculator
Online Interactive Calculator Provides Instantaneous Shielding Effectiveness Computation of Shielding Materials St. Louis, Missouri, USA – A...
Laird Technologies Publishes SMD Power Inductors Application Note
Topic Discusses How Power Inductors Yield Lower Core Losses and Provide a Stored Energy Source St. Louis, Missouri, USA – July 21, 2011 – La...
Laird Technologies Publishes Common Mode Choke Application Note
Topic Discusses How Common Mode Choke Filtering Improves CMRR in Ethernet Transformer Applications St. Louis, Missouri, USA – June 30, 2011 ...
Laird Technologies Releases New Tpcm™ 580SP Series Screen Printable Phase Change Material
New Phase Change Material Expands Company’s Thermal Interface Materials Product Line St. Louis, Missouri, USA – April 21, 2011– Laird Techno...
Laird Technologies Expands Thermal Gap Filler Product Line with Tputty™ 506 Series Silicone Putty
Thermal Gap Filler Specifically Designed for High-Wattage Electronic Applications St. Louis, Missouri, USA – March 24, 2011 – Laird Technolo...